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"Super Small X3 Package : World's smallest plastic molded package. 0.6 x 0.3 x 0.3 mm MLP
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Carsem
Founded in 1972, Carsem is a leading provider of turnkey packaging and test services to the semiconductor industry, offering one of the largest package and test portfolios in the world. The company has three high-technology factories, all incorporating highly sophisticated, "state-of-the-art" equipment, ensuring products which meet the exacting quality standards set by the automotive, telecom, computer, and consumer electronics industries.

Carsem factories maintain world-class quality standards. All factories have achieved ISO/TS 16949, ISO 9001, ISO 14001, ANSI/ESD S20.20 certifications and comply with the Sony Green Partner Program.