FCOL™ : Flip Chip on Leadframe
Carsem's patented FCOL (Flip Chip On Leadframe) is the process of flipping a bumped die onto a lead frame and then molding it using standard plastic package assembly processes. FCOL™ is available in standard packages such as MLP, SOT23, SC70, TSOT, QSOP and narrow body SOICs.
There are a wide range of applications for FCOL and some examples are :
For more information please contact your local sales office