PDIP Packages

Latest Technology Solutions
Carsem offers a variety of JEDEC compliant PDIP's (Plastic Dual-In-Line Package) for various IC applications. The lead counts offered include 8, 14 and 16 encapsulated in a 300 mil body width.


: Plastic Dual-In-Line Package

Package Type Lead Count
300 mils8/14/16

Bill of Material

Leadframe CDA 194
Die Attach Conductive Epoxy - 84-1 LMI-SR4
Wire Bond 1.0 to 1.3 mil gold wire
Mold Compound Sumitomo 6650 Series / G600 Series (Green)
Lead Finish 100% matte Tin
Marking Top - Laser
Packing Antistatic Tubes/Pins
Process Flow (NBM-No Bottom Mark) Carsem(S)
JEDEC Reference MS-001 (300 mils)

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification

Stress Conditions
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C

Reliability & MSL Results
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Thermal Data
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Electrical Data
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Datasheet / Drawings

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CLICK to view Package Outline
8 / 14 / 16 L