QFP Packages

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Carsem offers a variety of JEDEC compliant QFP (Quad Flat Package) for medium to high pin count IC's. The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of low profile packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.


MQFP (Metric Quad Flat Pack)
Body (mm) Lead Count
10 x 1044/52
14 x 2064/80/100/128

LQFP (1.4mm) (Low Profile Quad Flat Pack)
Body (mm) Lead Count
7 x 732/48
10 x 1044/52/64

Bill of Material

Leadframe C7025 / EFTEC64T
Die Attach 84-1 LMI-SR4
Wire Bond 1.0 / 1.2 / 1.3mils gold wire
Mold Compound G600 Series (Green) G700 Series (Green)
Lead Finish 100% matte Tin or NIPDAU
Marking Laser
Packing (JEDEC Trays) Bakeable - Thin Profile
Non-bakeable - Thin Profile
Process Flow CFC-QFP-LTM-NSD (Dry Pack) CFC-QFP-NSD-DP (Dry Pack)
CFC-QFP-LTM (No Dry Pack) CFC-QFP-NSD-NDP (No Dry Pack)
JEDEC Reference MS-022 3.2mm Footprint
MO-112 3.9mm Footprint
MO-143 2.6mm Footprint
MS-026 2.0mm Footprint

Package Performance

Reliability Data
Reference Specifications
Mil Standard 883 for Test Method and Procedures
J-STD-20 Moisture/Reflow Sensitivity Classification
JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification

Reference Specifications
Autoclave 1008 hours 121°C / 100% RH, 2 atm
Temp. Cycle 1000 cycles -65°C / +150°C
Thermal Shock 300 cycles -55°C / +125°C

Reliability & MSL Results
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Thermal Data
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Electrical Data
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Datasheet / Drawings

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