Test Services

Packaging
Testing
Latest Technology Solutions
 

Carsem is focused on turn-key services and thus has a total dedicated test and wafer probe area of 125,000 sq ft (11,700 sq m) containing over 500 testers and handlers. Carsem provides a full range of test services to meet the unique needs of our customer's device requirements including RF, mixed signal and power applications and currently test over 60% of the total units we assemble. (For more information about the MLP package family click here)

Carsem maintains a dynamic tester and handler technology roadmap to align our investments to our customer's needs and has a core dedicated staff of product, process and test engineers capable of developing custom solutions from scratch to address any specific device requirements. These solutions include program/hardware development services, program conversions, as well as, complete product engineering support including program debug, correlation, low yield analysis and test time reduction.

We have the ability to test devices for Bluetooth, WLAN, 802.11a/b/n/ac and a wide variety of other applications using test systems that include the LTX Fusion CX RF, Rack and Stack and Teradyne Catalyst/RF. Additional tester platforms for mixed signal, analog and power management devices include the TMT/ASL, Eagle, and Teradyne Microflex. Carsem is also familiar with a line of low cost mixed signal/analog testers such as Chroma, Amida, Powertech and Aemulus. Carsem provides both wafer probe services for wafers up to 8" in diameter (including hot chuck and wafer mapping features) and strip test for various MLP package dimensions (including packages sizes below 2x2 mm) . Other turn-key services include dry pack, tape and reel, finished goods inventory, bar code and drop shipment.


FACILITIES

Location : Malaysia & China



Floor Space : 125k sq. ft. (11.7k M²)
   

Equipment :
  • Temperature : 23 +/- 4°C
  • Humidity : 50 +/- 10%
ESD Controls :
  • Static Dissipative Flooring
  • Conductive Shoes
  • In-handler Ionizers
  • Grounded Work Stations
   


EQUIPMENT


MIXED SIGNAL/DIGITAL Testers
ManufacturerModelCapability
AMIDA 3001 XP 2 HOVI, 2 HVI, 32 Dig, 50MHz, 1 OTMU
CHROMA 3650 CX 128 Dig ch, 50MHz, 16 DPS
CREDENCE ASL1000 DVI, MUX, TMU, PVI, ACS, OAL, OVI, PV3
ASL3000 DVI2K, DVI300, MUX
TERADYNE ETS364APU12, SPU100, QTMU, DPU16, HPU
ETS200T-FT Dual Die MOSFET testing with Rg/UIL
ETS88 Two Sector with APU12, SPU100, SPU112, QTMU, DPU16
ETS800 Two Sector with APU32A, SPU2112A, UPD64, HSD32, QMS
J750EX 256 Ch, 200MHz, 16 DPS
CATALYST-100/LC 56 Digital pins, 100Mhz, PACS
MICROFLEX DC30, DC90, HSD200, BBAC, POOL2
LTX FUSION CX 802.11 a/b/g, 32 OVI, 24 Dig, 8 RF16 Ports, 4 SigGens
POWERTECH QT4100 DC 1kv/100A + DVSD, UIS 100A, RgCg
NI NI-STS T1 Analog/Linear:44 ch (24v/100ma and 200V),32 Dig
Mix Sig: 96 Dig ch, 84 Analog channels(24v/100mA)
Advantest V93K PS1600 ATH/CTH 272 PS1600 Dig ch (100MHz), 112 PS1600 Dig Ch(533MHz), 16M pat depth, DPS 64 ch, 32MB x32 Vector Memory, TMU x32

RF Testers
ManufacturerModelCapability
AEMULUS AMB 4200 Aeroflex, 12 Dig Ch, 24 Analog, 4 TMU
AGILENT Rack & Stack N5230C PNA, B2901/2 Precision SMU, PA Box
CREDENCE
TMT
ASL3000RF 8 High Power Ports 6GHz, 3 SMIQ SigGem, DVI2K, OVI300
LTX FUSION CX (Dragon HummingBird) 802.11 a/b/g, 32 OVI, 24 DIG, 8 RF16 Port,
4 SIGGEN
FUSION PAx 802.11 a/b/g/n/ac, 8 RF16D Port, 8 OVI, 8 HOVI,
16 DIG
TERADYNE CATALYST-100 (RF) 6GHz with Frequency Hopping

Handlers
ManufacturerModel Test Sites Package Capability
JHT EXCEED 6080HR 4 QFP | MLP | ARRAY PACKAGES
EXCEED 8008HR 8 QFP | MLP | ARRAY PACKAGES
EXCEED 8016HR 16 QFP | MLP | ARRAY PACKAGES
HONTECH 9080 8 QFP | MLP | ARRAY PACKAGES
9040 4 QFP | MLP | ARRAY PACKAGES
SEIKO EPSON 6040 4 QFP | MLP | ARRAY PACKAGES
EXISTECH EXIS250 4 3,5,6 SOT23 | MSOP | MLP
EXIS400H 2 5 , 6 SOT23
EXIS400 8 5 , 6 SOT23
ASM FT MINI 2 MLP
CHROMA 3180 4 MLP
3180C 4 SOICW
SRM STV242 1 SOT143
S248 4 MLP
D248 4 SOT23 , MLP
XD248 4 SOT883 , SC70 , SOT23 , MLP , SOICN
XD244 4 MLP
XDH326 2 MLP
XD206 4 ODFN
ISMECA NT116 2 3,5,6 SOT23 | 5, 6 SC70 | SOD323
NT216 2 3,5,6 SOT23 | 5, 6 SC70 | SOD323
NX16 4 SOT23
PENTAMASTER PM6322 4 SOICN
PM3510 4 MLP,SC70,SOT23,SOICN
PM4200 4 DDPAK
MULTITEST 85XX 1 PDIP
9308 4 QSOP | SOICN | TSSOP
9320 4 QSOP | SOICN | TSSOP
9918 8 QFN | MLP
9928 8 QFN | MLP
RASCO SO1000 4 MSOP | SOICN | SSOP
TESEC 9718 1 5 , 6 SOT23
9110 1 SOT223 | SO8

Wafer Probe
ManufacturerModel Test Sites Package Capability
TEL TEL8 1 Wafer Probe (6"-8") with wafer mapping capability
TSK UF200 1 Wafer Probe (4"-8") with wafer mapping capability
   

Other Equipment Experience :
  • MT9510
  • SO 2000T
  • EG 2001
  • TESEC 9110-IH
  • TESEC 9218-HT
Other Test Equipment :
  • Systemation Peel Strength
  • Giant Force Bake Ovens
  • Itermec Barcode Printers
  • Strappers and Sealers
  • Micro VU Profile Projector
  • ICOS CI9450, MQFP, LQFP Lead Scanner
  • Visdynamic EVO2
  • Visdynamic G6
  • ICOS G10
   


SERVICES


We have over 50 highly trained & experienced engineers in our test organization. Below is a highlight of some of the services and capabilities.


Test Engineering

Product Engineering

  • Test program debug & correlation
  • Low Yield Analysis
  • Yield improvement
  • Product Failure Analysis
  • Comprehensive Test Program
  • Release Controls

Test Development

  • Carsem has a Test Development lab, equipped with low cost testers. Using both internal resources and third party relationships with test development and ATE companies, we have the ability to design and develop software and hardware on major test platforms including Teradyne A5xx series, Catalyst, TMT, EAGLE, LTX, Amida, Aemulus and Chroma.

Test Development Lab

Equipment Engineering

  • Fully trained to be self-sufficient in calibration and repair of all equipment
  • Coordination of sockets, contactors and handlers for all new Carsem packages
Other Services
  • Customised advanved lot tracking system
  • Reliability testing
  • Lead scanning
  • Dry packing
  • Tape & Reel
  • Drop ship
IT in Test

IT Test Applications

  • TADS (Test Abnormality Detection System)
  • eSBL (Statistical Bin Limit)
  • eCTCN (Carsem Test Change Notice for New Test Program Introduction And Program Uprev)
  • AutoOEE (Tester OEE)
  • VMS (Equipment DownTime tracking system)

Remote Access

  • Customer Engineers are able to remotely login to the Tester work station to debug technical issues

Program/File Managment

  • Login account and password will be assigned
  • Comprehensive Managment Prorocedures
  • Network Testers
  • Carsem Ethernet

Transfer Modes

  • File Transfer Protocol (FTP)