Founded in 1972, M – Site, Malaysia was acquired by Hong Leong Group in June 1984. The factory has a total floor space of 436,000 sq. ft. (40,500 m²). M-Site is focused on Assembly only and Final Electrical Test on the products is supported at S – Site.
S – Site, Malaysia commenced operations in April,1992. The factory has a total floor space of 640,000 sq. ft. (60,000 m²). S – Site supports Assembly and Final Electrical Test for both M – Site and S – Site.
Carsem Suzhou, China commenced production in July 2004. The factory has a total floor space of 600K sq. ft. (56,000 m²). SZ – Site is focused on assembly and test for the MLP-Micro Leadframe Package (QFN Format) and Laminate products.
Carsem Suxiang (CSX), China commenced production in May 2025. In Phase I, the factory has a construction area of 77k sqm, with Cleanroom area of 35k sqm. CSX is focused on assembly and test for the SOP package, QFP package, TO package, Flip Chip , IPM and MLP-Micro Leadframe Package (QFN Format).
Carsem Bangkok (CSB), Thailand commenced assembly production in 1989 and full turnkey production for Memory products in 1990. The factory has a land area of 71.9k sqm, with Operation 17.5k sqm and Cleanroom area of 8.4k sqm. CSB is focused on assembly for the TSOP, FBGA, MCP, Flip-chip BGA and LGA packages; furthermore, test for PQFP, SOIC and QFN packages. The products include NOR, NAND, RAM, MCU, Digital and IoT. Proven capabilities in enabling cutting-edge semiconductor solutions across Automotive Memory, Connectivity, IoT.
- Various package bodies size & thickness
- Ball count: 24 – 192 balls
- Body size: 4.5×4.5 – 15×17 mm
- Ball size: 0.25 – 0.6 mm
- Ball Pitch: 0.5 – 1.0 mm
- Various pkg bodies size & thickness
- Ball count: 24 – 192 balls
- Body size: 5.5×5.5 – 14×18 mm
- Pyramid (2 – 6 die stacked)
- Side by side (2 – 5 die)
- Various pkg bodies size & thickness
- Ball count: 49 – 300 balls
- Body size: 4.0×4.5 – 13.0×13.0mm
- Die size: 2.45×2.7 – 7.5×5.0mm
- Ball size: 0.25 – 0.5mm
- Ball pitch:0.4 – 0.8mm
- Various pkg bodies size & thickness
- Body size: 5×5 – 27x29mm
- Die size: 0.734×0.944 – 15.635×10.606
- Single & Multichip die (4 die Stack and Side-by side 2-3 die)
- TSOP 048
- TSOP2048 (2 Die stacked)
- TSOP4048 (4 die stacked)
- TSOP056
Backgrinding
DFM2700/DPG8760/DFG8450
Applications: FBGA, MCP, LGA, FCBGA, TSOP
- Integrated system (BG + WM + Detape)
- 200/300mm wafer size capability
- Poly grinding wheel for wafer thk <100um
- Roughness <30um, 8000 grid size wheel
- Die thinning capability @ 50um
- 2 in 1 tape (DAF/FOW)
- Thickness accuracy 5um
Laser Grooving / Dicing
DISCO DFL7160/DFD6361/6340
Applications: FBGA, MCP, LGA, FCBGA, TSOP
- 200/300mm wafer size capability
- Laser groove for low k wafers (1um accuracy)
- Mechanical dicing with step cut capability
- Saw street width min @ 50um
- Saw kerf accuracy 2um
Die Attach
DISCO DFL7160/DFD6361/6340
Applications: FBGA, MCP, LGA, FCBGA, TSOP
- 200/300mm wafer size capability
- Thin die at 50um
- Side by side & die stacking capability
- Epoxy/DAF/FOW capability
- Minimum die size @ 0.25×0.25mm
- Die placement accuracy = xy 30um
Flip Chip Die Attach
BESI Datacon 8800 FC Quantum
Application: FCBGA
- C4 bump, Cu pillar capability
- Accuracy ± 5 µm @ 3 sigma
- Strip size support up to 300×200 mm
- Flux dipping process
F/Chip Reflow & Cleaning
KNS Rapid Pro/ProCu/Iconn/Ultra
Application: FCBGA
- Dual lane configuration up to 2 x 300 mm
- 9 heat zones / 3 cooling zones
- Water jet cleaning
Wire Bonding
Reflow Centurion CT930 & Cleaning Electrovert Augastrom 100
Applications: FBGA, MCP, LGA, TSOP
- Side by side & die stacking capability
- Fine pitch capability @ 40um (ProCu up)
- Min 0.6 mils wire dia. (Pro Cu up)
- Auto Forming Gas control for Cu wire
- Cu kit for Cu WB capability
- Strip size 100x300mm (Rapid Pro)
- 2um accuracy bonding area 56X80 mm
Molding (WB)
Dai-Ichi GP-Pro8
Applications: FBGA, MCP, LGA, TSOP
- Auto molding / Transfer molding
- Max clamp force 80 ton
- Vacuum Assist Molding (VAM)
- Min. mold clearance 150um, without VAM
- Min. mold clearance 130um, with VAM
Molding (FCBGA)
FICO AMS-LM
Application: FCBGA
- Auto molding/Transfer molding
- Max 60 ton floating clamping system
- Dynamic temperature control
- Max substrate size 101 x 280 mm
- Min. mold clearance 50 um above die/30 um MUF with VAM
- Anti molded block warp using boards clamped and cooled down
Ball Attach/ Reflow & Cleaning
Shibuya SBM351 + RI / Chipflo6 / Cleanvy FW4
Applications: FBGA, MCP, LGA, FCBGA
- Min. ball diameter 0.25mm
- Min. ball pitch 0.4 mm
- Min. ball pitch for Vision 40 um
- Max. strip bow 8 mm
- 6-zone reflow (Chipflow6)
- Water soluble flux, with post reflow cleaning
Saw Singulation
GSP Gravita 36 / Hanmi 3500D/SBS8808/DFD6750/DFD6340
Applications: FBGA, MCP, LGA, FCBGA
- Dual spindle, single chuck
- Min. package size – 3 x 3 mm²
- Saw street width 0.35mm
- Saw accuracy 3um
- Max mold block warpage 40 mils
- Max strip bow 8 mm
- Vision capability for ball (min. 0.2mm) & land pad
Solder Plating
Technic SP744
Application: TSOP
- In-house auto electro-plating, with in-line electro deflash
- Pure Tin
Trim & Form
Fico Compact Line / Fico TFM-1A
Application: TSOP
- Single shot forming
- Final lead cut as last step – consistent lead span
- Integrated GaN (iGaN) in TFLGA-27: 110, 140, 270, 500 m-Ohm
- SEMPER™ family of secured and reliable NOR flash
- Next Gen USB C PD controllers for in cabin charging and entertainment systems
