The growth in Electrical/ Hybrid Electrical Vehicles and advancement with ICE have pushed the automotive segment to next level for semiconductor packaging – aiming to deliver greater safety technology and green technologies. Carsem understands the fast evolving needs of the auto industry and has been adapting to these changes with latest developments in the semiconductor technology. Carsem has a strong position and packaging experience in segments related but not limited to growing vehicle electrification, under the hood applications, and the vehicle safety and comfort segment.
Our key focus areas:
- SiP Technologies
- Custom Module packages
- MEMS & Sensors Packages
- Power Packages
- Routable lead frame and MIS for Wettable flank
Carsem is continuously investing in R&D, equipment infrastructure, and automation in line with its Industry 4.0 strategy, positioning itself strongly to enable its automotive customers in their pursuit of transformational technologies.
With the growth in 5G and advent of autonomous vehicles, Carsem technology is propelled into new and advanced segments like ceramic based packages, routable QFNs and molded interconnect systems (MIS), with many packages in advanced state of development. Carsem is also close to launching hermetical & non hermetical ceramic packages, which will propel future growth.
