The growth in Electrical/ Hybrid Electrical Vehicles and advancement with ICE have pushed the automotive segment to next level for semiconductor packaging – aiming to deliver greater safety technology and green technologies. Carsem understands the fast evolving needs of the auto industry and has been adapting to these changes with latest developments in the semiconductor technology. Carsem has a strong position and packaging experience in segments related but not limited to growing vehicle electrification, under the hood applications, and the vehicle safety and comfort segment.
Our key focus areas:
- SiP Technologies
- Custom Module packages
- MEMS & Sensors Packages
- Power Packages
- Routable lead frame and MIS for Wettable flank
Carsem is continuously investing in R&D, equipment infrastructure, and automation in line with its Industry 4.0 strategy, positioning itself strongly to enable its automotive customers in their pursuit of transformational technologies.
With the growth in 5G and advent of autonomous vehicles, Carsem technology is propelled into new and advanced segments like ceramic based packages, routable QFNs and molded interconnect systems (MIS), with many packages in advanced state of development. Carsem is also close to launching hermetical & non hermetical ceramic packages, which will propel future growth.
Enabled by：
- Acceleration sensors
- Sensor interfaces
- System ICs
- Inertia sensors
- Angular rate sensors
Technology Deployed：
- Reliability : MSL 1, Grade 0 BOM
- System in package technology
Enabled by：
- Inertia sensors
Technology Deployed:
- BGA Technology
Enabled by:
- Acceleration sensors
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
Enabled by:
- Acceleration sensors
- Inertia sensors
- Angular rate sensors
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
Enabled by:
- Pressure sensors
- Drivers
- Sensor interfaces
- System Ics
Technology Deployed:
- Cavity packages on lead frame / subsrate technology
- Harsh media compatible packages
- System in package technology
Enabled by:
- Pressure sensors
- Regulators
- System Ics
Technology Deployed:
- Cavity packages on lead frame / subsrate technology
- Harsh media compatible packages
Enabled by:
- System Ics
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
- Lead frame / Cearmic / MIS base packages
Enabled by:
- Transceivers
- Regulators
- Amplifiers
Enabled by：
- Acceleration sensors
- Sensor interfaces
- System ICs
- Inertia sensors
- Angular rate sensors
Technology Deployed：
- Reliability : MSL 1, Grade 0 BOM
- System in package technology
Enabled by：
- Inertia sensors
Technology Deployed:
- BGA Technology
Enabled by:
- Acceleration sensors
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
Enabled by:
- Acceleration sensors
- Inertia sensors
- Angular rate sensors
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
Enabled by:
- Pressure sensors
- Drivers
- Sensor interfaces
- System Ics
Technology Deployed:
- Cavity packages on lead frame / subsrate technology
- Harsh media compatible packages
- System in package technology
Enabled by:
- Pressure sensors
- Regulators
- System Ics
Technology Deployed:
- Cavity packages on lead frame / subsrate technology
- Harsh media compatible packages
Enabled by:
- System Ics
Technology Deployed:
- Reliability : MSL 1, Grade 0 BOM
- Lead frame / Cearmic / MIS base packages
Enabled by:
- Transceivers
- Regulators
- Amplifiers