Meet complex market needs with extensive package offerings

    Carsem has a broad portfolio of packaging solutions to address a variety of industrial requirements

    The rise in data volume is parallel with the implementation of the automation of smart machines as well as the need for computational  power and connectivity. The Cloud is seen as the solution for these data processing.

    Carsem provides solution for power management packaging for the Cloud network infrastructure. These power management packaging includes the hardware components for the power supply, microcontroller and the server rack such as the SiP in QFN/DFN, TO, SOT, and SoC. Carsem is striving further to improve the process and packaging capability in power packaging.

    For the current Industrial market, Carsem is aligned with the Fourth Industrial Revolution or best known as the Industry 4.0.

    The Industry 4.0 technology strives on the improved automation, machine-to-machine and human-to-machine communication, artificial intelligence, self monitoring and production of smart machines that can analyze and diagnose issues without the need of human involvement.

    In industrial factory and process automation, embedded industrial products reduce manufacturing costs, energy consumption and enhance precision and reliability. The energy management segment optimizes energy demand and supply and improves energy efficiency. Reducing the size, weight, and power (SWaP) of medical devices provides a driving force for new medical and healthcare monitoring designs. In the aerospace market, SWAP-C (size, weight, power, and cost) is used to identify key design criteria. Microelectromechanical systems (MEMS) sensing and actuation devices increasingly provide leading-edge solutions to these segments.

    Serving this broad industrial market, Amkor provides Power Discretes, SSOP, SOIC, PBGA, MLF®, QFP, CABGA including FCBGA and fcCSP technologies for sensor, processor, logic, analog, driver, power, memory, RF, cameras and storage.