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Industrial

    We offer best in class packaging technologies to meet the increasingly demanding performance requirements of data center applications

    The rise in data volume is parallel with the implementation of the automation of smart machines as well as the need for computational  power and connectivity. The Cloud is seen as the solution for these data processing.

    Carsem provides solution for power management packaging for the Cloud network infrastructure. These power management packaging includes the hardware components for the power supply, microcontroller and the server rack such as the SiP in QFN/DFN, TO, SOT, and SoC. Carsem is striving further to improve the process and packaging capability in power packaging.

    For the current Industrial market, Carsem is aligned with the Fourth Industrial Revolution or best known as the Industry 4.0.

    The Industry 4.0 technology strives on the improved automation, machine-to-machine and human-to-machine communication, artificial intelligence, self monitoring and production of smart machines that can analyze and diagnose issues without the need of human involvement.

    Enabled by:

    • AC-DC Converter
    • DC-DC Converter
    • Linear Voltage Regulator
    • Low Voltage Regulator
    • MOSFET

    Technology Deployed:

    • System-in-Package
    • Quad-Flat No Lead Package
    • Transistor Outline Package
    • Small Outline Transistor Package

    Enabled by:

    • DC-DC Controller
    • Integrated Driver
    • MOSFET

    Technology Deployed:

    • System-in-Package
    • Quad-Flat No Lead Package
    • Transistor Outline Package

    Enabled by:

    • DC-DC Controller
    • MOSFET
    • Operational Amplifiers
    • Transceiver
    • RF Transmitter

    Technology Deployed:

    • System-in-Package
    • Quad-Flat No Lead Package
    • Transistor Outline Package
    • Small Outline Transistor Package
    • System-on-Chip