An interconnect technology designed to address performance requirements of high power semiconductor components
- Copper clip is typically used in MOSFETs to create a direct electrical and heat path from the drain and source of a vertical MOSFET die structure
- Greater package reliability
- Better thermal transfer
- Ultra-fast switching
- Package construction : QFN/DFN/PDFN Leadframe base
- Package size: 2x3mm to 6x6mm
- Package Thickness from 0.9 mm to 1.1 mm
- Consumer electronics
- Commercial electronics
- Charger
- Power Tool