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Copper Clip

    An interconnect technology designed to address performance requirements of high power semiconductor components

    • Copper clip is typically used in MOSFETs to create a direct electrical and heat path from the drain and source of a vertical MOSFET die structure
    • Greater package reliability
    • Better thermal transfer
    • Ultra-fast switching
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    Features

    • Package construction : QFN/DFN/PDFN Leadframe base
    • Package size: 2x3mm to 6x6mm
    • Package Thickness from 0.9 mm to 1.1 mm

    Applications

    • Consumer electronics
    • Commercial electronics
    • Charger
    • Power Tool