FBGA Package
Fine Pitch Ball Grid Array (FBGA)
FBGA is a compact evolution of the standard BGA package, designed for high-density applications. It utilizes a grid of solder balls on the bottom of the package for external electrical connectivity.
Carsem Bangkok (CSB) offers comprehensive assembly and test solutions for FBGA solutions offer precision engineering with ball pitches ranging from 0.25 mm to 0.60 mm, ensuring high-performance connections in a smaller footprint
- Ball counts : 24 to 238
- Package size : 4.5×4 to 17×17 mm
- Epoxy, DAF (Die attach film)
- Die to lead wire bonding
Consumer Electronics
- Smartphones / tablets (AP, memory, PMIC)
- Wearables and IoT devices
Computing
- DRAM / NAND Flash
- CPUs, GPUs, chipsets
- USB-C
Automotive
- ADAS processors
- Infotainment PSoCs
- ECU controllers
Communication
- RF modules
- 5G baseband / networking
Industrial
- Embedded processors
| Package Type | Ball Count | Pitch (mm) | Body Width (mm) | Body Length (mm) | Body Thickness (mm) |
| Fine Pitch Ball Grid Array (FBGA) | 24 – 238 | 0.25 – 0.60 mm | 4.5-17.0 mm | 4.0-17.0 mm | 0.8-1.85 mm |
| Substrate | BT/CCL ,2 & 4 layers |
| Die Attach | PFAS Free Conductive / Non-Conductive Epoxy Die attach film (DAF) |
| Wire Bond | 0.7 to 0.8 mils /CuPd/CuPdAu /Au Wire |
| Mold Compound | Standard/Low/Super Low alpha |
| Solder Ball | SAC105/305/405/125 & SnPb |
| Marking | Top – Laser |
| Packing | Tray / Tape & Reel |
| JEDEC Reference | JESD30 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |