Flip-Chip Packaging
Flip-chip is a high-performance semiconductor packaging technology where the die is “flipped” and connected directly to the substrate via solder bumps. A critical stage in this process is Wafer Bumping, where solder “bumps” are formed on the wafer prior to dicing.
Carsem Bangkok (CSB) we specialize in high-performance flip-chip technologies, providing flexible options for single die.
- Ball counts : 49 to 300
- Package size : 7×6 mm to 13×13 mm
- Pre-solder substrate
- Bump type: solder bump
- Solder bump wafer, Height & Pitch 90 um , 200 um
- Mold under fill (MUF)
- In-line die attach, reflow and cleaning systems for high process control
Solutions for Wireless and IoT
Computing & Data Center
- Networking ASICs / Wireless
Consumer Electronics
- IoT devices
| Package Type | Ball Count | Pitch (mm) | Body Width (mm) | Body Length (mm) | Body Thickness (mm) |
| Flip-Chip BGA | 49 – 300 | 0.25 – 0.60 mm | 7.0-13 mm | 6.0-13 mm | 1.0-2.03 mm |
| Substrate | BT/CCL ,2 & 4 layers |
| Die Attach | Not applicable |
| Wire Bond | Not applicable |
| Mold Compound | Low/Super Low alpha |
| Lead Finish | Lead Free |
| Marking | Top – Laser |
| Packing | Tray / Tape & Reel |
| JEDEC Reference | JESD30 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |