Flip Chip Package, which the face-down silicon die is directly attached to the leadframe or substrate with solder bumps or Cu pillar instead of wire bonds. Carsem can provide signal and multiple Flip chip die in package, also can provide hybrid package including flip chip die, wire bonding die with passive components.
- Shortest electrical path
- High electrical and thermal performance
- Better solder joint reliability
- Low cost for assembly
Applicable for a wide range of semiconductor device types in consumer market
Such as Switch, LNA, Filter, WLAN, RF PA, Memory, CPU etc.