MCP Package
Multi-Chip BGA
Multi-Chip is a compact evolution of the standard BGA package with multiple die stacked and side by side dies for high-density applications. It utilizes a grid of solder balls on the bottom of the package for external electrical connectivity
Carsem Bangkok (CSB) offers advanced Multi-Chip Package (MCP) solutions in Ball Grid Array (BGA) formats. By integrating multiple integrated circuits, semiconductor dies, and discrete components onto a single substrate, our MCP technology creates a unified, high-performance system.
- Ball counts : 24 to 192
- Package size : 6x5mm to 19×14 mm
- Epoxy, FOW (film on wire), DAF (Die attach film)
- Die to lead , Die to Die wire bonding , SSB
Solutions for NOR, NAND, SRAM, Wireless, USB-C, Power Sensor , Micro controller and handheld portable devices
Mobile & Consumer Electronics
- Smartphones
- Tablets
- Wearables
- Smart cameras
Automotive
- Infotainment systems
- ADAS modules
- Digital clusters
Industrial & IoT
- Edge devices
- Smart meters
- Embedded controllers
Computing & Networking
- Routers
- AI edge modules
- Compact computing systems
| Package Type | Ball Count | Pitch (mm) | Body Width (mm) | Body Length (mm) | Body Thickness (mm) |
| Multi-Chip Package (MCP) | 24 – 192 | 0.25 – 0.60 mm | 6-19 mm | 5.0 – 14 mm | 0.75-2.0mm |
| Substrate | BT/CCL ,2 & 4 layers |
| Die Attach | PFAS Free Conductive / Non-Conductive Epoxy Die attach film (DAF) Film on wire FOW |
| Wire Bond | 0.8 mils CuPd/CuPdAu /Au Wire |
| Mold Compound | Standard/Low/Super Low alpha |
| Solder Ball | SAC105/305/405/125 |
| Marking | Top – Laser |
| Packing | Tray / Tape & Reel |
| JEDEC Reference | JESD30 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |