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MEMS & Sensors - Overview

    A Trusted & Proven MEMS Partner

    Carsem is a global leader in MEMS & Sensors advanced packaging & test and is among the world’s leaders in microelectronics packaging.

    Carsem has a dedicated MEMS & Sensors Business Unit (MSU) which drives focused investments in this area. MSU boasts of “advanced design, development & prototyping capabilities” to accelerate MEMS products towards mass manufacturing. By virtue of a strong automotive MEMS sensor portfolio, MSU’s emphasis on Quality continues to inspire customer’s confidence in its capabilities to launch new sensor packages in a variety of applications including Industrial, IoT, and Consumer segments.

    Turnkey MEMS & Sensor Services

    Our dedicated and experienced MEMS Team can provide comprehensive turn-key solutions that begins with package co-design, thermal/stress simulations, engineered BOM selection for reliability, qualification support and in-house test development.

    USA, Computer Chip, Circuit Board, Merging, Technology

    Package Offerings

    Environmental Hub MEMS Sensors Package Overview
    • Custom Molded Cavity Packages
    • Lid packages with metal and plastics (LCP)
    • Laminate and lead-frame base packages
    Inertial Hub MEMS Sensors Package Overview
    • SOIC family
    • QFN / DFN & Micro Leadframe Packages (MLP)
    • LGA (LF, MIS) and Custom Packages
    Magnetic & Optical Hub MEMS Sensors Package Overview
    • SOIC family
    • LGA (MIS) and Custom Packages

    Types of packaging solutions within MEMS & sensors

    APPLICATIONS
    CONSUMER
    INDUSTRIAL
    AUTOMOTIVE
    MEMS & SENSOR PACKAGING TYPE OVERMOLD MOLDED EXPOSED DIE CAVITY / LID PACKAGES
    Inertial Accl, IMU Magnetic Current Pressure Humidity Pressure Humidity Gas
    STANDARD JEDEC PACKAGES
    CUSTOMIZED PACKAGES
    SUBSTRATE BASED PACKAGES (MIS / BGA / LGA / CERAMIC)

    Types of packaging solutions within MEMS & sensors

    Carsem MEMS Sensors Business Unit Product Portfolio

    PRODUCT TYPE PLATFORM PRODUCT SIZE THICKNESS (MOLD CAP) SUBSTRATE / FRAME THICKNESS
    LGA OVERMOLD AND PREMOLD 2MMX2MM UP TO 10MMX10MM 0.52MM TO 1.2MM 120UM TO 320UM
    QFN OVERMOLD STEP CUT AND INSERT MOLDING 3MMX3MM UP TO 12MMX12MM 0.6MM TO 1.0MM 6MIL AND 8MIL
    IC OVERMOLD, PREMOLD AND INSERT MOLDING SOICN / SOICW / CUSTOM JEDEC 8MIL AND 10MIL

    Carsem MEMS Sensors Business Unit Product Portfolio

    Carsem Advantage

    Experienced MEMS Staff
    • A Fully Dedicated MEMS Staff
    • History of Launching Difficult MEMS Sensors
    Simulation, Analysis, And Design Optimization
    • Thermal-Mechanical Simulation
    • Electrical Simulations
    • RF Simulation
    • Mold Flow Simulation
    • For Package & Board Level Reliability
    Advanced Core Technology & Toolbox
    • Cutting Edge MEMS Packaging Roadmap
    • Advanced Electronics Materials Roadmap
    • Advanced MEMS Wafer & Die Preparation
    • Advanced MEMS Die Bond & Wirebonding
    • Advanced Molding Technology for MEMS
    • System in Package (SiP) Technology
    • Flip Chip and CuPillar Technology
    • Molded Interconnect Substrates (MIS)
    Dedicated MEMS Manufacturing Lines
    • Dedicated MEMS Manufacturing Line
    • IATF 16949, ISO-9001, ISO-14001, ANSI/ESD
    • Investment in the latest Equipment
    • State-of-the-Art Industry 4.0 Assembly
    • Manufacturing Excellence System (MES)
    • Complete traceability and data analytics

    Availability

    Packages : LGA / MIS from 2mmx2mm to 10mmx10mm
    • Mold cap: 0.52mm – 1.2mm
    • Substrate thickness: 120um – 320um
    • Capability integration with SMT from 0201, 0402 and 0603
    Packages : MLP from 2mmx2mm to 10mmx10mm
    • Mold cap: 0.52mm – 1.2mm
    • Lead frame thickness: 150um to 200um
    Customized Cavity package and Over mold packages on substrate and lead frame
    • The packages performance depends on customer requirements from MSL, MSL2 , MSL 3 to Automotive Grade 0 to 3.
    Packages : LGA / MIS from 2mmx2mm to 10mmx10mm
    Packages : MLP from 2mmx2mm to 10mmx10mm
    Customized Cavity package and Over mold packages on substrate and lead frame
    • Mold cap: 0.52mm – 1.2mm
    • Substrate thickness: 120um – 320um
    • Capability integration with SMT from 0201, 0402 and 0603
    • Mold cap: 0.52mm – 1.2mm
    • Lead frame thickness: 150um to 500um
    • The packages performance depends on customer requirements from MSL 1, MSL 2 , MSL 3 to Automotive Grade 0 to 3.