MICRO - Overview
Micro offers a wide range of package portfolios, with an array of leaded industry standard packages for the manufacturers of discrete devices, passives, and low lead count IC devices. It ranges from Small Outline Transistors (SOT23/SC70) to Small Outline Packages (SSOP/TSSOP/MSOP) to Power Management packages (T0220/DDPAK/SOT223/MLP Punched) to Customized packages (UB/UC/UE/LS/LR/OMP/SMP). Most Micro Packages are available in traditional and COL configurations. Some of these packages are also available in below configurations:
- Flip Chip (Solder Bump & Copper Pillar)
- Chip on Lead (COL)
- Multiple Die
- Stack Die
High volume manufacturing for both automotive & commercial applications.
Note: Specialize in custom package outline to meet customer requirements for automotive applications. Please contact or email to sales office for enquiries.
|Package Type||Description||Lead Count|
|SOT23||Small Outline Transistor||3/5/6/8|
|TSOT||Thin Small Outline Transistor||5/6/8|
|SC70 (SOT323)||Shrink SOT Package||3/4/5/6|
Bill Of Material & Reliability Performance
- Carsem offer standard material for low cost and high MSL performance.
- Support specific or non standard bill of material to meet customer requirement
Reliability & MSL Results
- Please Contact Sales Office for Package Specific Results