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MICRO - Power Package

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    In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.

    Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC’s and power devices. Some of these packages are also available in below configurations

    • Single & Dual Cu clip capability for PDFN 5X6 in standard & 100X300mm leadframe platform.
    • Thin Die capability
    • Solder paste & high thermal epoxy

    Applications

    Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.

    Availability

    Package Type Description  Lead Count
    SOT223 Small Outline Transistor 4
    TO220  Transistor Outline 3/5/7
    TO263 (DDPAK) Transistor Outline 3/5/7
    PDFN 5X6 Punch Dual Flat No Lead 8

    Package Outline Drawing & Datasheet

    Click lead count to view Package Outline
    SOT223 4 L
    TO220 3/5/7 L
    DDPAK (TO263) 3/5/7 L
    PDFN 5X6 8 L

    Bill Of Material & Reliability Performance

    • Carsem offer standard material for low cost and high MSL performance
    • Support specific or non standard bill of material to meet customer requirement

    Reliability & MSL Results

    • Please Contact Sales Office for Package Specific Results