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MLP - Overview

    Carsem‘s MLP (Micro Leadframe Package) is a family of JEDEC compliant QFN and DFN plastic packages. This near CSP package family is available in two versions.

    The primary package offering is a sawn package. This is offered in a quad configuration (MLPQ) and a dual configuration (MLPD). Standard body sizes are available from 0.6×0.3 to 12×12. Specialized and custom body sizes are also available on 0.1mm body size increments. These packages are offered in a variety of package thickness profiles。

    A full range of turnkey test solutions and services are available for this package family.

    MLP Quad/Dual

    MLP Popular Tooled Package Sizes
    Standard MLP-Dual
    0.3 x 0.6 thru 5 x 6 mm
    2 – 22 I/O
    Standard MLP-Quad
    2 x 2 thru 10 x 10 mm
    6 – 72 I/O

     

    CLICK to view MLP Surface Mount User’s Guide

    Custom sizes are available upon request.

    Semi-Custom Packages Available in Selected 0.1 mm Body Size Increments
    Carsem Suzhou: Footprint Compatible Packages
    The terminals of these packages match the surface mount layouts of the following packages: SOIC, SOT23, SC70 Packages 0402 & 0201 & 01005 SMT Components
    Carsem S Site: Footprint Compatible Packages
    The terminals of these packages match the surface mount layouts of the following packages: SOIC, SOT23, SC70 Packages 0402 & 0201 SMT Components
    Typical Terminal Pitch (e)
    1.27, 1.00, 0.95, 0.80, 0.65, 0.50, 0.40, 0.35 mm
    Carsem Suzhou: Available Standard Package Profile Heights (A max)
    1.5, 1.2, 1.0, 0.80, 0.65, 0.55, 0.50, 0.40, 0.32 For other package height requirements, contact your local Carsem Sales Office
    Carsem S Site: Available Standard Package Profile Heights (A max)
    1.0, 0.80, 0.65, 0.55, 0.50, 0.40, 0.32 For other package height requirements, contact your local Carsem Sales Office
    MLPQ/D – EP MLPQ/D – COL MLPQ/D – FCOL
    Leadframe CDA194 / C7025 / Eftec64T
    Die Attach QMI 519 ABLESTIK 8006 N.A.
    Carsem Suzhou: Wire Bond 0.7 / 0.8/0.9/1.0/1.3/2.0mil Au or Cu wire N.A.
    Carsem S Site: Wire Bond 0.8/0.9/1.0/1.3/2.0mil Au or Cu wire N.A.
    Flipchip N.A. N.A. Flux
    Mold cpd G770H series (Green)
    Lead Finish Matte Tin / NiPdAu
    Marking Laser (For Marking capability Click – Sawn)
    Packing Canister, Tube, Tray, or Tape & Reel
    Process Flow CFCS-MLP / CFCS-MLP-NiPdAu-CD CFCA-FC-MLP-CD-TINP
    JEDEC Reference (Typical) MLPQ-EP : MO-220 (<3×3 : MO-255)
    MLPD-EP : MO-229 (<3×3 : MO-252)
    MLPQ/DH-EP (Punched)
    Leadframe C194
    Die Attach Sumitomo 1076DJ
    Wire Bond 1.0mil Au wire
    Mold cpd E670 (Green)
    Lead Finish Matte Tin Plate
    Marking Laser (For Marking capability Click –Punch)
    Packing Tube, Tray or Tape & Reel
    Process Flow CFCM-MLPDH/QH-STD
    JEDEC Reference (Typical) MLPQ-EP : MO-220 MLPD-EP : MO-229

    Reliability Data

    References Specifications
    Mil Standard 883 for Test Method and Procedures
    J-STD-20 Moisture/Reflow Sensitivity Classfication
    IPC-9701 for Board Level Reliability
    Reference Specifications
    Autoclave 1008 hours 121°C / 100% RH, 2 atm
    Temp. Cycle 1000 cycles -65°C / +150°C
    Thermal Shock 300 cycles -55°C / +125°C
    Board Stress 2000 cycles -40°C / +100°C

    Reliability & MSL Results

    Please Contact Sales Office for Package Specific Results

    Database

    CLICK to view MLP Datasheet | Clear MLP Datasheet | X3 MLP Datasheet
    CLICK to view MLP Surface Mount User’s Guide

    Drawings

    CLICK to view Package Outline
    MLPQ – (SAWN) MLPD – (SAWN)
    MLPQ MLPD
    MLPQH – (PUNCHED) MLPDH – (PUNCHED)
    STANDARD 5X6
    CUCLIP | 5X6