A multi-chip module (MCM) is a specialized electronic package where multiple Integrated circuits (ICs), semiconductor dies or other discrete components are packaged onto a unifying leadframe or substrate, facilitating their use as a single assembled component. MCM technology eliminates the need for multiple packages which can significantly reduce inter-package propagation delay, power consumption of the system and overall footprint.
With ever increasing demands for miniaturization and higher operating speeds, multi-chip module systems (MCMs) become increasingly attractive in a variety of applications. The “chip-stack” package, a development in MCM technology, is an attractive option in many applications such cell phones, smart phones and tablets.
- Lower cost
- Lower power consumption
- Smaller package sizes enable greater miniaturization
- Smaller overall footprint that multi-individual packages
- Faster time-to-market (ideal for product with short life cycles)
- Flexibility through integration of differing semiconductor technology
- Simplification of complexity by putting several devices into a single package
- Greater reliability with decreased number of interconnects between components
- Automotive
- LED arrays
- Portable electronics
- RF wireless modules
- Power amplifiers & Server
- Military and space avionics
- High-density single module computers
- High-power communication devices & Wearable computers
- Efficient strip processing (HD Format)
- Multi die capability
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- Stacked die capability
- Reduced clearance die to die spacing
- Attach processes
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- Epoxy die attach – dispense and COL
- Solder paste: SMT / die / cu clip attach
- Chip shooters for SMT component attach
- Epoxy die attach – solder replacement (development activity)
- Interconnect processes
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- Flip-Fels – solder paste
- Flipchip – solder bumps / Cu pillar bumps
- Wirebond – Au and Cu wire capable – multiple wire sizes
- Increased routability
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- xDap – under evaluation
- eMLP – qualifications underway
- Multi-die capability
- Thermal management solutions
- Package heights as low as 0.8mm
- Typical package sizes : 2×2 to 7×7
- RF wire loop & ultra-low wire loop control
Let Carsem design your custom configuration today!