• Connect with Carsem

MLP - Package Miniaturization

    Applications

    Package Miniaturization is necessary for new generation devices where thickness, size, weight, and package performance are paramount. Typical applications include WiFi-enabled handsets, tablets and mobile/portable systems

    Features

    • Terminal pitch as low as 0.35mm
    • Profile heights as low as 0.32mm
      • Ultra low loop wire bonding for extremely thin package profiles
      • Wafer Background and polish down to 0.1mm
    • Process enhancements for reduction of package area :
      • Tight multi-die and stacked die clearances
      • Die overhang, COL (Chip On Lead) and FCOL (FlipchipCOL) for larger die to package ratio (from 0.25 to 0.65)

    Full turnkey services, Electrical Test, Tape/Reel solutions available for all miniaturization programs