Combining MLP multi chip module (MCM) and RF test capability, Carsem is able to offer full turnkey solutions for MLP RF devices. MCM allows a single unit to be multi-functional, e.g. amplifiers, filters, switches, etc.
- Solutions for Wireless and handheld portable devices
- Front-End-Module, Power Amplifier (WLAN/Cellular), Switches, Transceivers.
- Multi die capability
- Ability to mix technology GaS, GAN and Silicon wafer technology into 1 package
- Industry leading Die to Die Spacing
- Controlled wire looping profile
- ALN (Aluminium Nitride) Substrate / Die Stacking
- Thermal Dissipation Solutions
- Package Miniaturization (As small as 0.3 x 0.6 mm)
- Package Profiles as low as 0.32 mm
- Scalable platform for multi-site testing (Test)
- Capable to support WiFi, 802.11ac, LTE (Test)
Carsem’s SiP (System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.
- Package construction : Leadframe and Laminate based
- Package size up to 12×12 mm
- Terminal Pitches as fine as 0.4mm
- Package Thickness from 0.5 mm to 2.5 mm
- Flip chip, wire bond and stacked die capabilities
- Ability to mount passive components as small as 0201
There is an almost endless list of potential SiP applications and some examples are:
- BluetoothTM Wireless Devices
- 802.11 WLAN Applications
- Power Management Devices
- GPS Modules
- Internet Mini-Systems
