• Connect with Carsem

MLP - RF Solutions

    Introduction

    Combining MLP multi chip module (MCM) and RF test capability, Carsem is able to offer full turnkey solutions for MLP RF devices. MCM allows a single unit to be multi-functional, e.g. amplifiers, filters, switches, etc.

    mlprsf2
    mlprsf1
    mlprsf2
    mlprsf1

    Applications

    • Solutions for Wireless and handheld portable devices
    • Front-End-Module, Power Amplifier (WLAN/Cellular), Switches, Transceivers.

    MLP-RF Features

    • Multi die capability
    • Ability to mix technology GaS, GAN and Silicon wafer technology into 1 package
    • Industry leading Die to Die Spacing
    • Controlled wire looping profile
    • ALN (Aluminium Nitride) Substrate / Die Stacking
    • Thermal Dissipation Solutions
    • Package Miniaturization (As small as 0.3 x 0.6 mm)
    • Package Profiles as low as 0.32 mm
    • Scalable platform for multi-site testing (Test)
    • Capable to support WiFi, 802.11ac, LTE (Test)

    SiP

    Carsem’s SiP (System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.

    mlprsf7
    mlprsf8
    mlprsf7
    mlprsf8

    Features

    • Package construction : Leadframe and Laminate based
    • Package size up to 12×12 mm
    • Terminal Pitches as fine as 0.4mm
    • Package Thickness from 0.5 mm to 2.5 mm
    • Flip chip, wire bond and stacked die capabilities
    • Ability to mount passive components as small as 0201

    Applications

    There is an almost endless list of potential SiP applications and some examples are:

    • BluetoothTM Wireless Devices
    • 802.11 WLAN Applications
    • Power Management Devices
    • GPS Modules
    • Internet Mini-Systems
    mlprsf4
    mlprsf3
    mlprsf4
    mlprsf3