Carsem is a global leader in MEMS & Sensors advanced packaging & test and is among the world’s leaders in microelectronics packaging.

Carsem has a dedicated MEMS & Sensors Business Unit (MSU) which drives focused investments in this area. MSU boasts of “advanced design, development & prototyping capabilities” to accelerate MEMS products towards mass manufacturing. By virtue of a strong automotive MEMS sensor portfolio, MSU’s emphasis on Quality continues to inspire customer’s confidence in its capabilities to launch new sensor packages in a variety of applications including Industrial, IoT, and Consumer segments.

Our dedicated and experienced MEMS Team can provide comprehensive turn-key solutions that begins with package co-design, thermal/stress simulations, engineered BOM selection for reliability, qualification support and in-house test development.

ENVIRONMENTAL HUB MEMS SENSORS PACKAGE OVERVIEW

• Custom Molded Cavity Packages
• Lid packages with metal and plastics (LCP)
• Laminate and lead-frame base packages

INERTIAL HUB MEMS SENSORS PACKAGE OVERVIEW

• SOIC family
• QFN / DFN & Micro Leadframe Packages (MLP)
• LGA (LF, MIS) and Custom Packages

MAGNETIC & CURRENT HUB MEMS SENSORS PACKAGE OVERVIEW

• SOIC family
• LGA (MIS) and Custom Packages

EXPERIENCED MEMS STAFF

• A Fully Dedicated MEMS Staff
• History of Launching Difficult MEMS Sensors

DEDICATED MEMS MANUFACTURING LINES

• Dedicated MEMS Manufacturing Line
• IATF 16949, ISO-9001, ISO-14001, ANSI/ESD
• Investment in the latest Equipment
• State-of-the-Art Industry 4.0 Assembly
• Manufacturing Excellence System (MES)
• Complete traceability and data analytics

ADVANCED CORE TECHNOLOGY & TOOLBOX

• Cutting Edge MEMS Packaging Roadmap
• Advanced Electronics Materials Roadmap
• Advanced MEMS Wafer & Die Preparation
• Advanced MEMS Die Bond & Wirebonding
• Advanced Molding Technology for MEMS
• System in Package (SiP) Technology
• Flip Chip and CuPillar Technology
• Molded Interconnect Substrates (MIS)

SIMULATION, ANALYSIS, AND DESIGN OPTIMIZATION

• Thermal-Mechanical Simulation
• Electrical Simulations
• RF Simulation
• Mold Flow Simulation
• For Package & Board Level Reliability

• 1) Packages : LGA / MIS from 2mmx2mm to 10mmx10mm
  • Mold cap: 0.52mm – 1.2mm
  • Substrate thickness: 120um – 320um
  • Capability integration with SMT from 0201, 0402 and 0603

  2) Packages : MLP from 2mmx2mm to 10mmx10mm

  • Mold cap: 0.52mm – 1.2mm
  • Lead frame thickness: 150um to 200um

  3) Customized Cavity package and Over mold packages on substrate and lead frame

  The packages performance depends on customer requirements from MSL, MSL2 , MSL 3 to Automotive Grade 0 to 3.