In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.
Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.
In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.
Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.
In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.
Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.
In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.
Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.
Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC’s and power devices. Some of these packages are also available in below configurations
- Single & Dual Cu clip capability for PDFN 5X6 in standard & 100X300mm leadframe platform.
- Thin Die capability
- Solder paste & high thermal epoxy
| Package Type | Description | Lead Count |
| SOT223 | Small Outline Transistor | 4 |
| TO220 | Transistor Outline | 3/5/7 |
| TO263 (DDPAK) | Transistor Outline | 3/5/7 |
| PDFN 5X6 | Punch Dual Flat No Lead | 8 |
- Carsem offer standard material for low cost and high MSL performance
- Support specific or non standard bill of material to meet customer requirement
- Please Contact Sales Office for Package Specific Results