In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.
Application: Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.
Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC’s and power devices. Some of these packages are also available in below configurations
- Single & Dual Cu clip capability for PDFN 5X6 in standard & 100X300mm leadframe platform.
- Thin Die capability
- Solder paste & high thermal epoxy
| Package Type | Description | Lead Count |
| SOT223 | Small Outline Transistor | 4 |
| TO220 | Transistor Outline | 3/5/7 |
| TO263 (DDPAK) | Transistor Outline | 3/5/7 |
| PDFN 5X6 | Punch Dual Flat No Lead | 8 |
Note : Specialized in Custom Package Outline or Leaded Power Module with passive packaging to meet customer requirement for automotive application. Please contact or email to sales office
Carsem offer standard material for low cost and high MSL performance.
Support specific or non standard bill of material to meet customer requirement
Please Contact Sales Office for Package Specific Results