MICRO - Power Package

    In addition, Micro BU provides a diversity of surface mountable and thermally enhanced packages for power management ICs and power devices in the form of SOT223 (4leads), T0220 and DDPAK (3/5/7 leads) packages and the JEDEC compliant MLP5x6mm punched version. These power devices can withstand stress conditions in Autoclave for 96 hours @ 121°C/ 100% RH, 2atm and Temp cycle of 200,500 cycles@ -65°C / +150°C.

    Application: Mostly used on computer motherboards, LED TVs, servers, laptops and automotive segments.

    Carsem offers a wide variety of surface mountable and thermally enhanced packages for power management IC’s and power devices. Some of these packages are also available in below configurations

    1. Single & Dual Cu clip capability for PDFN 5X6 in standard & 100X300mm leadframe platform.
    2. Thin Die capability
    3. Solder paste & high thermal epoxy


    Package Type Description Lead Count
    SOT223 Small Outline Transistor 4
    TO220 Transistor Outline 3/5/7
    TO263 (DDPAK) Transistor Outline 3/5/7
    PDFN 5X6 Punch Dual Flat No Lead 8

    Note : Specialized in Custom Package Outline or Leaded Power Module with passive packaging to meet customer requirement for automotive application. Please contact or email to sales office

    Bill Of Material & Reliability Performance

    Carsem offer standard material for low cost and high MSL performance.
    Support specific or non standard bill of material to meet customer requirement

    Reliability & MSL Results

    Please Contact Sales Office for Package Specific Results

    Package Outline Drawing & Datasheet

    Click lead count to view Package Outline
    SOT223 4 L
    TO220 3 / 5 / 7 L
    DDPAK (TO263) 3 / 5 / 7 L
    PDFN 5X6 8 L