Carsem offers a variety of JEDEC compliant QFP (Quad Flat Package) for medium to high pin count IC’s.

    The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of low profile packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.

    MQFP (Metric Quad Flat Pack)
    Body (mm) Lead Count
    10 x 10 44/52
    14 x 20 64/80/100/128
    LQFP (1.4mm) (Low Profile Quad Flat Pack)
    Body(mm) Lead Count
    7 x 7 32/48
    10 x 10 44/52/64
    Leadframe C7025 / EFTEC64T
    Die Attach 84-1 LMI-SR4
    Wire Bond 1.0 / 1.2 / 1.3mils gold wire
    Mold Compound G600 Series (Green) G700 Series (Green)
    Lead Finish 100% matte Tin or NIPDAU
    Marking Laser
    Packing (JEDEC Trays) Bakeable – Thin Profile
    Non-bakeable – Thin Profile
    Process Flow CFC-QFP-LTM-NSD (Dry Pack) CFC-QFP-NSD-DP (Dry Pack)
    CFC-QFP-LTM (No Dry Pack) CFC-QFP-NSD-NDP (No Dry Pack)
    JEDEC Reference MS-022 3.2mm Footprint
    MO-112 3.9mm Footprint
    MO-143 2.6mm Footprint
    MS-026 2.0mm Footprint
    References Specifications
    Mil Standard 883 for Test Method and Procedure
    J-STD-20 Moisture/Reflow Sensitivity Classification
    JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification
    Reference Specifications
    Autoclave 1008 hours 121°C / 100% RH, 2 atm
    Temp. Cycle 1000 cycles -65°C / +150°C
    Thermal Shock 300 cycles -55°C / +125°C
    Reliability & MSL Results

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