Carsem offers a variety of JEDEC compliant QFP (Quad Flat Package) for medium to high pin count IC’s.
The MQFP is available in body sizes ranging from 10 x 10mm to 14 x 20mm with lead counts from 24 to 100. The LQFP is a family of low profile packages with body sizes ranging from 7 x 7mm to 10 x 10mm and lead counts from 32 to 64.
| Body (mm) | Lead Count |
| 10 x 10 | 44/52 |
| 14 x 20 | 64/80/100/128 |
| Body(mm) | Lead Count |
| 7 x 7 | 32/48 |
| 10 x 10 | 44/52/64 |
| MLPQ/D – EP | MLPQ/D – COL | |
| Leadframe | C7025 / EFTEC64T | |
| Die Attach | 84-1 LMI-SR4 | |
| Wire Bond | 1.0 / 1.2 / 1.3mils gold wire | |
| Mold Compound | G600 Series (Green) | G700 Series (Green) |
| Lead Finish | 100% matte Tin or NIPDAU | |
| Marking | Laser | |
| Packing (JEDEC Trays) | Bakeable – Thin Profile Non-bakeable – Thin Profile |
|
| Process Flow | CFC-QFP-LTM-NSD (Dry Pack) | CFC-QFP-NSD-DP (Dry Pack) |
| CFC-QFP-LTM (No Dry Pack) | CFC-QFP-NSD-NDP (No Dry Pack) | |
| JEDEC Reference | MS-022 3.2mm Footprint MO-112 3.9mm Footprint MO-143 2.6mm Footprint |
MS-026 2.0mm Footprint |
| References Specifications |
| Mil Standard 883 for Test Method and Procedure |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
| Reference Specifications | ||
| Autoclave | 1008 hours | 121°C / 100% RH, 2 atm |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| Thermal Shock | 300 cycles | -55°C / +125°C |
Please Contact Sales Office for Package Specific Results
Carsem Suxiang (CSX) offers a variety of JEDEC compliant QFP (Quad Flat Package), available for body sizes 7X7mm LQFP with lead counts from 48. CSX can further support customers to develop QFP for other body sizes.
| Package Type | Lead Count | Body size (mm) | Exposed Pad | Pad Size (mm) | Lead Pitch (mm) | LF Thickness (mil) |
| LQFP | 48L | 7.0*7.0*1.4 | YES | 5.2*5.2 | 0,5 | 5 |
LQFP: Low-profile Quad Flat Package
| LQFP (4.4mm) | |
| Leadframe | CDA 7025 |
| Die Attach | Conductive Epoxy – Hitachi EN4900GC |
| Wire Bond | 0.8 to 1.3 mils Cu wire or Au Wire |
| Mold Compound | Sumitomo G700QB |
| Lead Finish | 100% matte Tin |
| Marking | Top – Laser |
| Packing | Tray |
| JEDEC Reference | MS-026 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classfication |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
| Reference Specifications | ||
| Autoclave | 168 hours | 121°C/100% 29.7psia |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| UHAST | 192 hours | 130℃/85%RH 33.3psia |
| HTSL | 2000 hours | 150℃ |
| THT | 1000 hours | 85℃/85%RH |
| CLICK to view Package Outline | |
| LQFP POD | |