TO-247 is a standard high-power PTH package for high-voltage, high-current discrete semiconductors (MOSFETs, IGBTs, SiC/GaN devices), with excellent thermal performance and reliability.
- Excellent thermal dissipation and low thermal resistance
- High mechanical strength and stability
- Suitable for high voltage & current operation
- Compatible with Si, SiC, GaN materials
- Mature PTH process for mass production
- Industrial power supplies & frequency converters
- New energy power conversion
- Automotive electronics & power modules
- High-power equipment
- Rail transit & industrial control
| Package Type | Lead Count | Body size (mm) | Exposed Pad | Pad Size (mm) | Lead Pitch (mm) | LF thickness (mm) |
| TO247 | 3L | 15.8*21*5 | Yes | 12.5*7.42 | 5.44 | 2 |
| 4L | 15.94*23.45*5 | No | 12.5*7.42 | 5.08/2.54 | 2 |
| TO247 | ||
| Leadframe | Bare cooper/ Ni plated on lead | |
| Die Attach | soft solder with High Pb | |
| Wire Bond | 5~20mil Al Wire | |
| Mold Compound | Sumitomo EME-500/G700 seires | |
| Packing | Tube | |
Support specific or non-standard bill of material to meet customer requirement.
Please Contact Sales Office for Package Specific Results