TSOP Package
Thin Small Outline Package (TSOP)
A surface-mount integrated circuit packaging featuring a low-profile design (body thickness <1.2 mm) with leads on two sides. TSOP is an industry standard for high-density memory applications, including Flash, SRAM, DRAM
Carsem Bangkok (CSB) offers comprehensive assembly and test solutions for TSOP-I with pin counts of 48 and 56.
- Single and Multi chip (same die stacked 2 & 4 die)
- COL (Chip on lead)
- Die to lead & Die to Die wire bonding
Memory & Storage
- NAND Flash / NOR Flash
- DRAM / SDRAM
Consumer Electronics
- Networking equipment
- Wireless modules
- Baseband memory
Industrial & Embedded
- Embedded systems
- Industrial controllers
Automotive (low-power ICs)
- Voltage regulators
- Monitoring ICs
- Small control modules
TSOP is a cost-efficient and mature technology, making it the ideal choice for high-density memory and compact device applications. It is perfectly suited for high-volume consumer electronics, compact embedded systems, and low-power ICs.
| Package Type | Lead Count | Body Size (mm) | Lead Pitch (mm) | Lead frame Thickness (mm) |
| TSOP-I | 48L | 18.4x12x1 | 0.5 | 0.127 |
| 56L | 18.4x14x1 | 0.5 | 0.127 |
| Leadframe | Copper C194 Stamp & Etched |
| Die Attach | PFAS Free Conductive/ Non-Conductive Epoxy Die Attach Film (DAF) |
| Wire Bond | 0.8 to 1.0 mils Cu /CuPd/CuPdAu wire/Au Wire |
| Mold Compound | Standard/Low/Super Low alpha |
| Lead Finish | 100% matte Tin |
| Marking | Top – Laser |
| Packing | Tray / Tape & Reel |
| JEDEC Reference | MO-142 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |