Dedicated office for development engineers
With the debug ability on NI PXI, STS-T4, AMB7600/7600SR，Power Tech QT4100&QTT6000, ACCO8200/8300, AMIDA
Dedicated development room for hardware design & bench debug
With instrument : Keysight VNA E5071, SPECTRUM ANALYZER, DC Power supply, DMM, simulate load, LCR
Optional test platforms for different products
| Tester | Switch | LNA | Splitter | ANT Tuner | Filter | 4G/5G PA |
| LTX PAx AC | √ | √ | √ | √ | √ | √ |
| AMB7600 | √ | √ | √ | √ | √ | √ |
| LTX CX | √ | √ | √ | √ | √ | Χ |
| NI PXI | √ | √ | √ | √ | √ | Χ |
Rich development experience for RF product
- 2 dedicated development engineers focus on RF product
- More than 10 years development experience on RF test.
- Short implement cycle time(<1wk for nomal product)
- Test time reduction: Test item/limit optimization base on test data analyzing, Test method change/wait time reduction
- Major customer: ALP / MXD / RDA
Lost Solution with Ping-Pong mode
- Ping-Pong mode benefit: 30% of test cost saving.
Cost down solution
Tester efficiency
- To develop test solution on QTT / AMI to support Ping-Pong model
- Ping-Pong mode benefit: 30% of test cost saving.
- Major customers: AMZ / LIF / WIS
Test time reduction
- Test item/limit optimization base on data analyzing.
- Test method change/wait time reduction.
- AMZ / LIF / WIS (60ms-> 45ms)
Rich development experience for TVS product
- Hardware design and PCB layout.
- 2 dedicated experienced engineers focus on TVS product development.
- Short implement cycle time(1day for normal product after HW ready)
Key test parameter: Gain, PAE, Harmonic (2nd/3rd), P1dB/IP3, ACPR/EVM
Sub-6GHz 5G PA/FEM test
- Higher frequency (3.3GHz~4.9GHz)
- Higher bandwidth (>200MHz)
- Sub-6GHz 5G RF test solution can be worked out by upgrading our existing tester and handler within 2 months.
mmWave test
- Key test challenges at mmWave
Test Method of mmWave
- Wireless test head needed
- Isolation box needed(upgrading handler)
- New Tester needed(NI-STS)
| Product / Bandwidth | 2G | 3G | 4G | 5G | |
| 800MHz~2GHz | 2GHz~2.2GHz | 1.7G~2.7G | 3.3GHz~5.9GHz | >28GHz (mmWave) | |
| 6MHz~24MHz | 15MHz | 15MHz~130MHz | <160MHz | >400MHz | |
| Switch | √ | √ | √ | √ | Θ |
| Filter (SAW/BAW) | √ | √ | √ | √ | Θ |
| Diplexer / Multiplexer | √ | √ | √ | √ | Θ |
| PA (Power Amplifier) | √ | √ | √ | √ | Θ |
| LNA (Low Noise Amplifier) | √ | √ | √ | √ | Θ |
| Antenna Tuner | √ | √ | √ | √ | Θ |
| SiP (include 2 or more componenets into a package) | √ | √ | √ | √ | Θ |
Θ = Under Development
| Product / Bandwidth | 2G | 3G | 4G | 5G | |
| 800MHz~2GHz | 2GHz~2.2GHz | 1.7G~2.7G | 3.3GHz~5.9GHz | >28GHz (mmWave) | |
| 6MHz~24MHz | 15MHz | 15MHz~130MHz | <160MHz | >400MHz | |
| Switch | √ | √ | √ | √ | Θ |
| Filter (SAW/BAW) | √ | √ | √ | √ | Θ |
| Diplexer / Multiplexer | √ | √ | √ | √ | Θ |
| PA (Power Amplifier) | √ | √ | √ | √ | Θ |
| LNA (Low Noise Amplifier) | √ | √ | √ | √ | Θ |
| Antenna Tuner | √ | √ | √ | √ | Θ |
| SiP (include 2 or more componenets into a package) | √ | √ | √ | √ | Θ |
Θ = Under Development
| Technology Group | Handlers | Tester | Socket / Pin |
| Di-FEM (Filter+Switch) (<6GHz) |
CSZ capable | CSZ capable | CSZ capable |
| LFEM (Switch+LNA) (<6GHz) |
CSZ capable | CSZ capable | CSZ capable |
| PAMiD (PA+Filter) (<6GHz) |
CSZ capable | CSZ capable | CSZ capable |
| Wifi FEM (<7.125GHz) |
CSZ capable | CSZ capable | CSZ capable |
| mm Wave (>7.125GHz) |
Under Roadmap | Under Roadmap | Under Roadmap |
- Higher frequency (3.3GHz~4.9GHz)
- Higher bandwidth(>160MHz)
- 400MHz can be worked out by upgrading our existing tester and handler within 2 months
- Wireless test head needed
- Isolation box needed(upgrading handler)
- New Tester needed or upgraded (under development)
| Tester Type | Tester Model | Vendor | Qty | Origin | Capability |
| Mixed Signal | Eagle-364A | Teradyne | 5 | US | Support 2A max Current,100V max Vlotage, configC can up to 100A |
| Eagle-364B | 28 | US | |||
| Eagle-ETS88 | 10 | US | |||
| ASL1K | Cohu | 36 | US | 45V,2A(Can up to 100A) | |
| STS8200 | AccoTest | 22 | China | 50V,10A | |
| QTT8100 | PowerTech | 1 | China | 120V,10A | |
| STS8300 | AccoTest | 7 | China | 100A Floating VI source | |
| Amida 3001XP | Amida | 15 | China | 1A,45V | |
| RF | LTX PAX | Cohu | 3 | US | PAxAC:2SG for the dual sites,16 RF ports 6GHz source and 8GHz RF measurement, 16dBm max source level, 250MHz measure bandwidth. |
| PXI-NI | NI | 108 | US | ||
| AMB7600 | Aemulus | 23 | Malaysia | Aemulus: with wolfer option, can up to 35dBm source out | |
| Discrete | QT6100 | PowerTech | 23 | China | 600V,3A |
| QT4100B | PowerTech | 12 | China | DC: 1000V,100A; RG:4980A LCR meter& 25V max VDS; DVDS: 10A,200V; UIL: 200A Pulse,2000V& 0.01-59.9mH |
Remark: Soft docking, Short Test Time, Support Ping-pong, High Current (100A)
- 16/32 RF Ports
- 2 VST , Bandwidth 1G hz
- Fequency <6G Hz
- Digital channel: 32 /128M per channel
- Quadrant output , fully Kelvin connections
- Max DC ±10A / 40V
- 4K pattern depth, 16-Bit AWG per channel
- Can be upgrade 20V/100A
| Type | ||||
| Discrete | 45V 2A *ASL1000 |
DC 2000V 100A RG / CAP *QT4100 |
600V 3A 3CHs *QT6100 |
1200V 30A 6CHs *QT6200 |
| Mix Signal | 45V 2A 14MHz *ASL1000 |
100V 10A 66MHz *Eagle 364 |
50V 10A 100M *STS8200 |
100V 100A 100M *ST8300 |
| RF | *LTX CX | Frequency: <5.9G 90MHz *AMB7600 |
Frequency: <6G 1GHz *STS T4 PGT NI |
Frequency: >28G (5G) *NI STS |
QT4100
QT6100
STS8200
STS8300
Eagle364
AMB7600
STS T4
PGT NI
| Handle Type | Handler Model | Vendor | Qty | PKG size | Origin | Capability |
| Turret | SRM XD248 | SRM | 47 | MLP >= 2×2 | Malaysia | Thickness > 0.4 Room Temp |
| SRM Z208 | 110 | MLP >= 1.0×0.6 | Malaysia | Thickness > 0.25 Room Temp | ||
| SRM Z208T | 7 | MLP >= 1×1 | Malaysia | Thickness > 0.25 Room Temp | ||
| SRM XD208 | 3 | MLP >= 2×3 | Malaysia | Thickness > 0.6 Room Temp | ||
| SRM Z206 | 3 | MLP >= 1×1 | Malaysia | Thickness > 0.4 Room Temp Support Laser funtion |
||
| ISM NX16 | Cohu | 7 | X3 (0.3×0.6) | US | Room Temp | |
| ASM FT-Mini | ASM | 20 | 0.6*0.3 | China | Small package size | |
| Tesec 4170 | TESEC | 11 | MLP >= 1×1 | Japan | Package size 1×1 – 3×3 Up to 64 site |
|
| Strip Test | DPE K8 | MI Equipment | 8 | Malaysia | 12 inches capable | |
| Hontech 7045 | Hontech | 13 | MLP >= 3×3 | China | Room and Hot Temp | |
| Pick & Place | ADV 4841 | ADV | 12 | Japan | Tri-temp Up to 8 sites | |
| JHT Exceed-8008 | JHT | 22 | China |
Remark: High Speedup(up to 50k UPH), Ambient test, T&R Integrated, Mini Package Prefer (<3*3mm), Mini Package Thickness 0.3mm
Remark: Hard docking, Ambient/Hot/Cold Test, Bake after test
- SRM Z208, ISM NX16, ASM FT-MINI
- Package 0.6*0.3mm (T: 0.3mm)
- 5 sides Vision Inspection
- MTBA > 60 mins
- Max UPH 50k
- HT7045, HT1026, JHT Exceed-8008
- Tri temp(-55~130 ºC ±2 ºC )
- Max UPH 13k
- 16 sites max
| Type | ||||
| Turret | >2mm*2mm T>0.45mm *SRM XD248 *SRM F208 |
>0.6mm*0.3mm T>0.3mm *A SM FT-mini *Ismeca NX16 |
>0.6mm*0.3mm T>0.3mm *SRM Z208 (High UPH) |
>0.4mm*0.2mm T>0.25mm *Ueno SeiKi |
| Pick & Place | Room Temp >3*3mm *Hontech9040 |
Room Temp~120°c >3*3mm *JHT 6000H |
Room Temp~130°c >3*3mm *JHT 8008H |
Tri-Temp (-55~150°c) >3*3mm *Hontech 1026 |
| Scrip Test | >1*1mm up to 64 sites *Tesec 4170 |
>0.6mm*0.3mm *Mi DPE K8 |
>0.4*0.2mm *MIE Mi30 |
|
SRM XD248
ASM FT-Mini
SRM Z208
HT7045
JHT8008
TESEC 4170-IH