Test Capability

    Carsem is focused on turn-key services and thus has a total dedicated test and wafer probe area of 125,000 sq ft (11,700 sq m) containing over 500 testers and handlers. Carsem provides a full range of test services to meet the unique needs of our customer’s device requirements including RF, mixed signal and power applications and currently test over 60% of the total units we assemble.

    Carsem maintains a dynamic tester and handler technology roadmap to align our investments to our customer’s needs and has a core dedicated staff of product, process and test engineers capable of developing custom solutions from scratch to address any specific device requirements. These solutions include program/hardware development services, program conversions, as well as, complete product engineering support including program debug, correlation, low yield analysis and test time reduction.

    We have the ability to test devices for Bluetooth, WLAN, 802.11a/b/n/ac and a wide variety of other applications using test systems that include the LTX Fusion CX RF, Rack and Stack and Teradyne Catalyst/RF. Additional tester platforms for mixed signal, analog and power management devices include the TMT/ASL, Eagle, and Teradyne Microflex. Carsem is also familiar with a line of low cost mixed signal/analog testers such as Chroma, Amida, Powertech and Aemulus. Carsem provides both wafer probe services for wafers up to 8″ in diameter (including hot chuck and wafer mapping features) and strip test for various MLP package dimensions (including packages sizes below 2×2 mm) . Other turn-key services include dry pack, tape and reel, finished goods inventory, bar code and drop shipment.