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Test Development

    Carsem Suzhou, China

    Overview

    Dedicated office for development engineers

    With the debug ability on NI PXI, STS-T4, AMB7600/7600SR，Power Tech QT4100&QTT6000, ACCO8200/8300, AMIDA

    Dedicated develop room for hardware design & bench debug

    With instrument : Keysight VNA E5071, SPECTRUM ANALYZER, DC Power supply, DMM, simulate load, LCR

    Test Development Capability

    Test Solutions For RF Product

    Optional test platforms for different products

    Tester Switch LNA Splitter ANT Tuner Filter 4G/5G PA
    LTX PAx AC √ √ √ √ √ √
    AMB7600 √ √ √ √ √ √
    LTX CX √ √ √ √ √ Χ
    NI PXI √ √ √ √ √ Χ

    Rich development experience for RF product

    • 2 dedicated development engineers focus on RF product
    • More than 10 years development experience on RF test.
    • Short implement cycle time(<1wk for nomal product)
    • Test time reduction: Test item/limit optimization base on test data analyzing, Test method change/wait time reduction
    • Major customer: ALP / MXD / RDA

    Lost Solution with Ping-Pong mode

    • Ping-Pong mode benefit: 30% of test cost saving.

    Low Cost Solution For TVS Product

    Cost down solution

    Tester efficiency

    • To develop test solution on QTT / AMI to support Ping-Pong model
    • Ping-Pong mode benefit: 30% of test cost saving.
    • Major customers: AMZ / LIF / WIS

    Test time reduction

    • Test item/limit optimization base on data analyzing.
    • Test method change/wait time reduction.
    • AMZ / LIF / WIS (60ms-> 45ms)

    Rich development experience for TVS product

    • Hardware design and PCB layout.
    • 2 dedicated experienced engineers focus on TVS product development.
    • Short implement cycle time(1day for normal product after HW ready)

    RF FEM Test Technology Roadmap

    Key test parameter: Gain, PAE, Harmonic (2nd/3rd), P1dB/IP3, ACPR/EVM

    Section5G RF PA/FEM Test Solution

    Sub-6GHz 5G PA/FEM test

    • Higher frequency (3.3GHz~4.9GHz)
    • Higher bandwidth (>200MHz)
    • Sub-6GHz 5G RF test solution can be worked out by upgrading our existing tester and handler within 2 months.

    mmWave test

    • Key test challenges at mmWave

    Test Method of mmWave

    • Wireless test head needed
    • Isolation box needed(upgrading handler)
    • New Tester needed(NI-STS)

    Test Readiness for 5G RF product

    Product / Bandwidth 2G 3G 4G 5G
    800MHz~2GHz 2GHz~2.2GHz 1.7G~2.7G 3.3GHz~5.9GHz >28GHz (mmWave)
    6MHz~24MHz 15MHz 15MHz~130MHz <160MHz >400MHz
    Switch √ √ √ √ Θ
    Filter (SAW/BAW) √ √ √ √ Θ
    Diplexer / Multiplexer √ √ √ √ Θ
    PA (Power Amplifier) √ √ √ √ Θ
    LNA (Low Noise Amplifier) √ √ √ √ Θ
    Antenna Tuner √ √ √ √ Θ
    SiP (include 2 or more componenets into a package) √ √ √ √ Θ

    Θ = Under Development

    FEM Categories Vs Test

    Technology Group Handlers Tester Socket / Pin
    Di-FEM (Filter+Switch)
    (<6GHz)    		 CSZ capable CSZ capable CSZ capable
    LFEM (Switch+LNA)
    (<6GHz)    		 CSZ capable CSZ capable CSZ capable
    PAMiD (PA+Filter)
    (<6GHz)    		 CSZ capable CSZ capable CSZ capable
    Wifi FEM
    (<7.125GHz)    		 CSZ capable CSZ capable CSZ capable
    mm Wave
    (>7.125GHz)    		 Under Roadmap Under Roadmap Under Roadmap

    Test 5G Preparedness

    Sub-6GHz 5G PA/FEM test
    • Higher frequency (3.3GHz~4.9GHz)
    • Higher bandwidth(>160MHz)
    • 400MHz can be worked out by upgrading our existing tester and handler within 2 months
    Test Method of 5G mmWave
    • Wireless test head needed
    • Isolation box needed(upgrading handler)
    • New Tester needed or upgraded (under development)

    Test Equipment Roadmap

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    Tester Roadmap

    Carsem Suzhou overall tester model

    Tester Type Tester Model Vendor Qty Origin Capability
    Mixed Signal Eagle-364A Teradyne 5 US Support 2A max Current,100V max Vlotage, configC can up to 100A
    Eagle-364B 28 US
    Eagle-ETS88 10 US
    ASL1K Cohu 36 US 45V,2A(Can up to 100A)
    STS8200 AccoTest 22 China 50V,10A
    QTT8100 PowerTech 1 China 120V,10A
    STS8300 AccoTest 7 China 100A Floating VI source
    Amida 3001XP Amida 15 China 1A,45V
    RF LTX PAX Cohu 3 US PAxAC:2SG for the dual sites,16 RF ports 6GHz source and 8GHz RF measurement, 16dBm max source level, 250MHz measure bandwidth.
    PXI-NI NI 108 US
    AMB7600 Aemulus 23 Malaysia Aemulus: with wolfer option, can up to 35dBm source out
    Discrete QT6100 PowerTech 23 China 600V,3A
    QT4100B PowerTech 12 China DC: 1000V,100A; RG:4980A LCR meter& 25V max VDS; DVDS: 10A,200V; UIL: 200A Pulse,2000V& 0.01-59.9mH

    TVS tester roadmap

    Remark: Soft docking, Short Test Time, Support Ping-pong, High Current (100A)

    Final Test Capability

    STS T4 Tester
    • 16/32 RF Ports
    • 2 VST ,  Bandwidth 1G hz
    • Fequency <6G Hz
    • Digital channel: 32 /128M per channel
    ACCO 8200 Tester
    • Quadrant output , fully Kelvin connections
    • Max DC ±10A / 40V
    • 4K pattern depth, 16-Bit AWG per channel
    • Can be upgrade 20V/100A

    Tester Develop Roadmap

    Type
    2006 2010 2015 2018 2022
    Discrete 45V 2A
    *ASL1000    		 DC 2000V 100A RG / CAP
    *QT4100    		 600V 3A 3CHs
    *QT6100    		 1200V 30A 6CHs
    *QT6200
    Mix Signal 45V 2A 14MHz
    *ASL1000    		 100V 10A 66MHz
    *Eagle 364    		 50V 10A 100M
    *STS8200    		 100V 100A 100M
    *ST8300
    RF *LTX CX Frequency: <5.9G 90MHz
    *AMB7600    		 Frequency: <6G 1GHz
    *STS T4
    PGT NI    		 Frequency: >28G (5G)
    *NI STS

    QT4100

    QT6100

    STS8200

    STS8300

    Eagle364

    AMB7600

    STS T4

    PGT NI

    Handler Roadmap

    Carsem Suzhou overall handler model

    Handle Type Handler Model Vendor Qty PKG size Origin Capability
    Turret SRM XD248 SRM 47 MLP >= 2×2 Malaysia Thickness > 0.4 Room Temp
    SRM Z208 110 MLP >= 1.0×0.6 Malaysia Thickness > 0.25 Room Temp
    SRM Z208T 7 MLP >= 1×1 Malaysia Thickness > 0.25 Room Temp
    SRM XD208 3 MLP >= 2×3 Malaysia Thickness > 0.6 Room Temp
    SRM Z206 3 MLP >= 1×1 Malaysia Thickness > 0.4 Room Temp
    Support Laser funtion
    ISM NX16 Cohu 7 X3 (0.3×0.6) US Room Temp
    ASM FT-Mini ASM 20 0.6*0.3 China Small package size
    Tesec 4170 TESEC 11 MLP >= 1×1 Japan Package size 1×1 – 3×3
    Up to 64 site
    Strip Test DPE K8 MI Equipment 8 Malaysia 12 inches capable
    Hontech 7045 Hontech 13 MLP >= 3×3 China Room and Hot Temp
    Pick & Place ADV 4841 ADV 12 Japan Tri-temp Up to 8 sites
    JHT Exceed-8008 JHT 22 China

    Turret handler roadmap

    Remark: High Speedup(up to 50k UPH), Ambient test, T&R Integrated, Mini Package Prefer (<3*3mm), Mini Package Thickness 0.3mm

    Pick and place handler roadmap

    Remark: Hard docking, Ambient/Hot/Cold Test, Bake after test

    Final Test Capability

    Turret Handler
    • SRM Z208, ISM NX16, ASM FT-MINI
    • Package 0.6*0.3mm (T: 0.3mm)
    • 5 sides Vision Inspection
    • MTBA > 60 mins
    • Max UPH 50k
    Pick&Place Handler
    • HT7045, HT1026, JHT Exceed-8008
    • Tri temp(-55~130 ºC ±2 ºC )
    • Max UPH 13k
    • 16 sites max

    Test Handler Develop Roadmap

    Type
    2006 2010 2015 2018 2022
    Turret >2mm*2mm  T>0.45mm
    *SRM XD248
    *SRM F208    		 >0.6mm*0.3mm  T>0.3mm
    *A SM FT-mini
    *Ismeca NX16    		 >0.6mm*0.3mm  T>0.3mm
    *SRM Z208 (High UPH)    		 >0.4mm*0.2mm  T>0.25mm
    *Ueno SeiKi
    Pick & Place Room Temp >3*3mm
    *Hontech9040    		 Room Temp~120°c  >3*3mm
    *JHT 6000H    		 Room Temp~130°c  >3*3mm
    *JHT 8008H    		 Tri-Temp (-55~150°c)  >3*3mm
    *Hontech 1026
    Scrip Test >1*1mm up to 64 sites
    *Tesec 4170    		 >0.6mm*0.3mm
    *Mi DPE K8    		 >0.4*0.2mm
    *MIE Mi30

    SRM XD248

    ASM FT-Mini

    SRM Z208

    HT7045

    JHT8008

    TESEC 4170-IH