Assembly Overview

    Carsem offers innovative cost down and yield improvement solutions for various end applications. Our dedicated technology centre can partner with customers in developing new products, from prototyping to small scale production.

    Power Management

    MLP

    MEMS & Sensors

    SOIC

    MICRO

    Copper Clip

    LGA

    SIP

    Flip Chip

    TVS

    I.C

    QFP