Carsem offers a variety of JEDEC compliant PDIP’s (Plastic Dual-In-Line Package) for various IC applications. The lead counts offered include 8, 14 and 16 encapsulated in a 300 mil body width.
| Package Type | Lead Count |
| 300 mils | 8/14/16 |
| Type | Details |
| Leadframe | CDA 194 |
| Die Attach | Conductive Epoxy – 84-1 LMI-SR4 |
| Wire Bond | 1.0 to 1.3 mil gold wire |
| Mold Compound | Sumitomo 6650 Series / G600 Series (Green) |
| Lead Finish | 100% matte Tin |
| Marking | Top – Laser |
| Packing | Antistatic Tubes/Pins |
| Process Flow (NBM-No Bottom Mark) | Carsem(S) |
| CFCS-PDIP-NBM | |
| JEDEC Reference | MS-001 (300 mils) |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classfication |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
| Reference Specifications | ||
| Autoclave | 1008 hours | 121°C / 100% RH, 2 atm |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| Thermal Shock | 300 cycles | -55°C / +125°C |
| CLICK to view Package Outline |
| 8 / 14 / 16 L |
Please contact Sales Office
Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm wide body SOIC. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.
| Package Type | Lead Count |
| SOIC (150 mil) | 8/14/16 |
| SOIC (300 mil) | 16/20/24/28 |
| QSOP (150 mil) | 16/20/24/28 |
| QSOP (300 mil) | 36/44 |
| SSOP (5.3mm) | 20/24/28 |
| MSOP (3.0mm) | 8/10 |
| TSSOP (4.4mm) | 8/14/16/20/24/28/38 |
PDIP: Plastic Dual-In-Line Package
SSOP: Shrink Small Outline Package
QSOP: Quarter-pitch Small Outline Package
TSSOP: Thin Shrink Small Outline Package
MSOP: Mini Small Outline Package
| SOIC | ||
| Leadframe | CDA 194 | |
| Die Attach | Conductive Epoxy – QMI 519 | |
| Wire Bond | 1.0 to 1.3 mil gold wire | |
| Green Mold Compound | HITACHI CEL 8240 SERIES | |
| Lead Finish | 100% matte Tin or NiPdAu | |
| Marking | Top – Laser | |
| Packing | Tube or Tape & Reel | |
| Process Flow | Carsem (M) | |
| CFCM-HD-STD | ||
| JEDEC Reference | MSD-012 (150 mils) MS-013 (300 mils) |
|
| TSSOP (4.4mm) | MSOP (3.0mm) | |
| Leadframe | CDA 7025 | CDA 194 |
| Die Attach | Conductive Epoxy – QMI 519 | |
| Wire Bond | 1.0 / 1.3 mils gold wire (Cu Wire Optional) | |
| Mold Compound | HITACHI CEL 8240 SERIES |
HITACHI CEL 8420 SERIES |
| Lead Finish | 100% matte Tin or NiPdAu | |
| Marking | Top – Laser | |
| Packing | Antistatic Tube/Plugs | |
| Process Flow | Csm(M) : CFCM-HD-STD Csm(S) : CFCS-TSSOP-LTM |
Csm(M) : CFCM-HD-STD |
| JEDEC Reference | MO-153 | MO-187 |
| SSOP(5.3mm) | QSOP | |
| Leadframe | CDA 194 | |
| Die Attach | Conductive Epoxy – QMI 519 | |
| Wire Bond | 1.0 / 1.3 mils gold wire (Cu Wire Optonal) | |
| Green Mold Compound | HITACHI CEL 8240 SERIES (Green) | HITACHI CEL 8240 SERIES (Green) |
| Lead Finish | 100% matte Tin or NiPdAu | |
| Marking | Top – Laser | |
| Packing | Tube or Tape & Reel | |
| Process Flow | CFCM-HD-STD | Csm(M) : CFCM-HD-STD |
| Csm(S) : CFCS-QSOP-NBM | ||
| JEDEC Reference | MO-150 | MO-137 (150 mils) N/A (300 mils) |
| References Specifications | ||
| Mil Standard 883 for Test Method and Procedures | ||
| J-STD-20 Moisture/Reflow Sensitivity Classfication | ||
| JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification |
| Stress Conditions | ||
| Autoclave | 96 hours | 121°C / 100% RH, 2 atm |
| Temp. Cycle | 200,500,1000 cycles | -65°C / +150°C |
| Thermal Shock | N/A | N/A |
| CLICK to view Package Outline | ||
| SOIC – 150 mils | QSOP – 150 mils / Matrix | |
| SOIC – 300 mils | QSOP – 300 | |
| SSOP | MSOP – 8 / 10 L | |
| TSSOP | ||
Please contact Sales Office
Carsem Suxiang (CSX) offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. It is one of the most commonly used surface mount packages today.
| Package Type | Lead Count | Body size (mm) | Exposed Pad | Pad Size (mm) | Lead Pitch (mm) | LF Thickness (mil) |
| TSSOP | 38L | 9.7*4.4*0.9 | Yes | 6.7*3.16 | 0.5 | 5 |
| 38L | 9.7*4.4*0.9 | No | 5.5*3 | 0.5 | 5 | |
| 20L | 6.5*4.4*0.9 | Yes | 4.2*3 | 0.65 | 5 | |
| 16L | 5*4.4*0.9 | Yes | 3*3 | 0.65 | 5 | |
| 16L | 5*4.4*0.9 | Yes | 3*2.3 | 0.65 | 5 | |
| 16L | 5*4.4*0.9 | No | 3 *3 | 0.65 | 5 | |
| 14L | 5*4.4*0.9 | No | 4.2*3.2 | 0.65 | 5 | |
| 14L | 5*4.4*0.9 | No | 3.89*3 | 0.65 | 5 | |
| 14L | 5*4.4*0.9 | No | 4.19×3.2 | 0.65 | 5 | |
| 8L | 3.0*4.4*0.9 | No | 2.4*3.2 | 0.65 | 5 | |
| SOIC | 8L-FC | 4.89*3.9*1.47 | No | COL | 1.27 | 8 |
| 16L-WB | 10.21*7.5*2.34 | No | COL | 1.27 | 10 | |
| 16L-WB | 10.21*7.5*2.34 | No | 3.35*1.71/ | 1.27 | 10 | |
| 4.47*2.64 | ||||||
| 16L-FC | 10.21*7.5*2.34 | No | COL | 1.27 | 10 | |
| TSSOP: Thin Shrink Small Outline Package | ||||||
| SOIC: Small Outline Integrated Circuit | ||||||
| TSSOP (4.4mm) | SOIC | |
| Leadframe | CDA 7025 | CDA 194 & 151 |
| Die Attach | Conductive Epoxy – Hitachi EN4900GC Non-Conductive Epoxy – Hitachi EN4900GCN3 |
|
| Wire Bond | 0.8 to 1.3 mils Cu wire or Au Wire | 0.8 to 1.2 mils Cu wire or Au Wire |
| Mold Compound | Sumitomo G700QB | |
| Lead Finish | 100% matte Tin | |
| Marking | Top – Laser | Top – Laser or Bottom – Laser |
| Packing | Tube or Tape & Reel | |
| JEDEC Reference | MO-153 | MSD-012 (150 mils) MS-013 (300 mils) |
| References Specifications | ||
| Mil Standard 883 for Test Method and Procedures | ||
| J-STD-20 Moisture/Reflow Sensitivity Classfication | ||
| JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification |
| Reference Specifications | ||
| Autoclave | 168 hours | 121°C/100% 29.7psia |
| Temp. Cycle | 1000 cycles | -65°C / +150°C |
| UHAST | 192 hours | 130℃/85%RH 33.3psia |
| HTSL | 2000 hours | 150℃ |
| THT | 1000 hours | 85℃/85%RH |