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I.C

    PDIP Packages

    Carsem offers a variety of JEDEC compliant PDIP’s (Plastic Dual-In-Line Package) for various IC applications. The lead counts offered include 8, 14 and 16 encapsulated in a 300 mil body width.

    PDIP: Plastic Dual-In-Line Package
    Package Type Lead Count
    300 mils 8/14/16
    Type Details
    Leadframe CDA 194
    Die Attach Conductive Epoxy – 84-1 LMI-SR4
    Wire Bond 1.0 to 1.3 mil gold wire
    Mold Compound Sumitomo 6650 Series / G600 Series (Green)
    Lead Finish 100% matte Tin
    Marking Top – Laser
    Packing Antistatic Tubes/Pins
    Process Flow (NBM-No Bottom Mark) Carsem(S)
    CFCS-PDIP-NBM
    JEDEC Reference MS-001 (300 mils)
    Reliability Data
    References Specifications
    Mil Standard 883 for Test Method and Procedures
    J-STD-20 Moisture/Reflow Sensitivity Classfication
    JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification
    Reference Specifications
    Autoclave 1008 hours 121°C / 100% RH, 2 atm
    Temp. Cycle 1000 cycles -65°C / +150°C
    Thermal Shock 300 cycles -55°C / +125°C
    Drawings
    CLICK to view Package Outline
    8 / 14 / 16 L
    Datasheet

    Please contact Sales Office

    SOP Packages

    Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm wide body SOIC. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.

    Package Type Lead Count
    SOIC (150 mil) 8/14/16
    SOIC (300 mil) 16/20/24/28
    QSOP (150 mil) 16/20/24/28
    QSOP (300 mil) 36/44
    SSOP (5.3mm) 20/24/28
    MSOP (3.0mm) 8/10
    TSSOP (4.4mm) 8/14/16/20/24/28/38

    PDIP: Plastic Dual-In-Line Package
    SSOP: Shrink Small Outline Package
    QSOP: Quarter-pitch Small Outline Package
    TSSOP: Thin Shrink Small Outline Package
    MSOP: Mini Small Outline Package

    SOIC
    Leadframe CDA 194
    Die Attach Conductive Epoxy – QMI 519
    Wire Bond 1.0 to 1.3 mil gold wire
    Green Mold Compound HITACHI CEL 8240 SERIES
    Lead Finish 100% matte Tin or NiPdAu
    Marking Top – Laser
    Packing Tube or Tape & Reel
    Process Flow Carsem (M)
    CFCM-HD-STD
    JEDEC Reference MSD-012 (150 mils)
    MS-013 (300 mils)
    TSSOP (4.4mm) MSOP (3.0mm)
    Leadframe CDA 7025 CDA 194
    Die Attach Conductive Epoxy – QMI 519
    Wire Bond 1.0 / 1.3 mils gold wire (Cu Wire Optional)
    Mold Compound HITACHI
    CEL 8240 SERIES
    HITACHI
    CEL 8420 SERIES
    Lead Finish 100% matte Tin or NiPdAu
    Marking Top – Laser
    Packing Antistatic Tube/Plugs
    Process Flow Csm(M) : CFCM-HD-STD
    Csm(S) : CFCS-TSSOP-LTM
    Csm(M) : CFCM-HD-STD
    JEDEC Reference MO-153 MO-187
    SSOP(5.3mm) QSOP
    Leadframe CDA 194
    Die Attach Conductive Epoxy – QMI 519
    Wire Bond 1.0 / 1.3 mils  gold wire (Cu Wire Optonal)
    Green Mold Compound HITACHI CEL 8240 SERIES (Green) HITACHI CEL 8240 SERIES (Green)
    Lead Finish 100% matte Tin or NiPdAu
    Marking Top – Laser
    Packing Tube or Tape & Reel
    Process Flow CFCM-HD-STD Csm(M) : CFCM-HD-STD
    Csm(S) : CFCS-QSOP-NBM
    JEDEC Reference MO-150 MO-137 (150 mils)
    N/A (300 mils)
    Reliability Data
    References Specifications
    Mil Standard 883 for Test Method and Procedures
    J-STD-20 Moisture/Reflow Sensitivity Classfication
    JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification
    Stress Conditions
    Autoclave 96 hours 121°C / 100% RH, 2 atm
    Temp. Cycle 200,500,1000 cycles -65°C / +150°C
    Thermal Shock N/A N/A
    Drawings
    CLICK to view Package Outline
    SOIC – 150 mils QSOP – 150 mils / Matrix
    SOIC – 300 mils QSOP – 300
    SSOP MSOP – 8 / 10 L
    TSSOP
    Datasheet

    Please contact Sales Office