Carsem offers a variety of JEDEC compliant PDIP’s (Plastic Dual-In-Line Package) for various IC applications. The lead counts offered include 8, 14 and 16 encapsulated in a 300 mil body width.
Package Type | Lead Count |
300 mils | 8/14/16 |
Type | Details |
Leadframe | CDA 194 |
Die Attach | Conductive Epoxy – 84-1 LMI-SR4 |
Wire Bond | 1.0 to 1.3 mil gold wire |
Mold Compound | Sumitomo 6650 Series / G600 Series (Green) |
Lead Finish | 100% matte Tin |
Marking | Top – Laser |
Packing | Antistatic Tubes/Pins |
Process Flow (NBM-No Bottom Mark) | Carsem(S) |
CFCS-PDIP-NBM | |
JEDEC Reference | MS-001 (300 mils) |
References Specifications |
Mil Standard 883 for Test Method and Procedures |
J-STD-20 Moisture/Reflow Sensitivity Classfication |
JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |
Reference Specifications | ||
Autoclave | 1008 hours | 121°C / 100% RH, 2 atm |
Temp. Cycle | 1000 cycles | -65°C / +150°C |
Thermal Shock | 300 cycles | -55°C / +125°C |
CLICK to view Package Outline |
8 / 14 / 16 L |
Please contact Sales Office
Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. Body sizes range from 3 x 3mm for the MSOP to the 7.5 x 17.83mm wide body SOIC. Lead counts range from 8 to 56 with lead pitches from 0.5mm to 0.8mm.
Package Type | Lead Count |
SOIC (150 mil) | 8/14/16 |
SOIC (300 mil) | 16/20/24/28 |
QSOP (150 mil) | 16/20/24/28 |
QSOP (300 mil) | 36/44 |
SSOP (5.3mm) | 20/24/28 |
MSOP (3.0mm) | 8/10 |
TSSOP (4.4mm) | 8/14/16/20/24/28/38 |
PDIP: Plastic Dual-In-Line Package
SSOP: Shrink Small Outline Package
QSOP: Quarter-pitch Small Outline Package
TSSOP: Thin Shrink Small Outline Package
MSOP: Mini Small Outline Package
SOIC | ||
Leadframe | CDA 194 | |
Die Attach | Conductive Epoxy – QMI 519 | |
Wire Bond | 1.0 to 1.3 mil gold wire | |
Green Mold Compound | HITACHI CEL 8240 SERIES | |
Lead Finish | 100% matte Tin or NiPdAu | |
Marking | Top – Laser | |
Packing | Tube or Tape & Reel | |
Process Flow | Carsem (M) | |
CFCM-HD-STD | ||
JEDEC Reference | MSD-012 (150 mils) MS-013 (300 mils) |
TSSOP (4.4mm) | MSOP (3.0mm) | |
Leadframe | CDA 7025 | CDA 194 |
Die Attach | Conductive Epoxy – QMI 519 | |
Wire Bond | 1.0 / 1.3 mils gold wire (Cu Wire Optional) | |
Mold Compound | HITACHI CEL 8240 SERIES |
HITACHI CEL 8420 SERIES |
Lead Finish | 100% matte Tin or NiPdAu | |
Marking | Top – Laser | |
Packing | Antistatic Tube/Plugs | |
Process Flow | Csm(M) : CFCM-HD-STD Csm(S) : CFCS-TSSOP-LTM |
Csm(M) : CFCM-HD-STD |
JEDEC Reference | MO-153 | MO-187 |
SSOP(5.3mm) | QSOP | |
Leadframe | CDA 194 | |
Die Attach | Conductive Epoxy – QMI 519 | |
Wire Bond | 1.0 / 1.3 mils gold wire (Cu Wire Optonal) | |
Green Mold Compound | HITACHI CEL 8240 SERIES (Green) | HITACHI CEL 8240 SERIES (Green) |
Lead Finish | 100% matte Tin or NiPdAu | |
Marking | Top – Laser | |
Packing | Tube or Tape & Reel | |
Process Flow | CFCM-HD-STD | Csm(M) : CFCM-HD-STD |
Csm(S) : CFCS-QSOP-NBM | ||
JEDEC Reference | MO-150 | MO-137 (150 mils) N/A (300 mils) |
References Specifications | ||
Mil Standard 883 for Test Method and Procedures | ||
J-STD-20 Moisture/Reflow Sensitivity Classfication | ||
JESD 22- A113 for Preconditioning for Moisture / Reflow Sensitivity Classification |
Stress Conditions | ||
Autoclave | 96 hours | 121°C / 100% RH, 2 atm |
Temp. Cycle | 200,500,1000 cycles | -65°C / +150°C |
Thermal Shock | N/A | N/A |
CLICK to view Package Outline | ||
SOIC – 150 mils | QSOP – 150 mils / Matrix | |
SOIC – 300 mils | QSOP – 300 | |
SSOP | MSOP – 8 / 10 L | |
TSSOP |
Please contact Sales Office