MEMS & Sensors - Inertial Hub
Applications
- Automotive Accederometers
- Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation
Package Offering
- LGA
- QFN/DFN
- Custom Packages
Key Technologies
- Laser grooving/Low k Wafer
- Backgrind to 100um (300mm)
- Weltable flank step cut or side wall Etch options
- Laminate, MIS, lead Frame (LF)
- Transfer & Compression Molding
- Integrated EMI Shielding in package
- Wire AU (0.5mil-2.0mil) capability
Applications
- Automotive Accederometers
- Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation
Package Offering
- LGA
- QFN/DFN
- Custom Packages
Key Technologies
- Laser grooving/Low k Wafer
- Backgrind to 100um (300mm)
- Weltable flank step cut or side wall Etch options
- Laminate, MIS, lead Frame (LF)
- Transfer & Compression Molding
- Integrated EMI Shielding in package
- Wire AU (0.5mil-2.0mil) capability