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Carsem (M) Sdn Bhd

MEMS & Sensors - Inertial Hub

    Applications

    • Automotive Accederometers
    • Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation

    Package Offering

    • LGA
    • QFN/DFN
    • Custom Packages

    Key Technologies

    • Laser grooving/Low k Wafer
    • Backgrind to 100um (300mm)
    • Weltable flank step cut or side wall Etch options
    • Laminate, MIS, lead Frame (LF)
    • Transfer & Compression Molding
    • Integrated EMI Shielding in package
    • Wire AU (0.5mil-2.0mil) capability

    Applications

    • Automotive Accederometers
    • Consumers IMU for smartphone, Gaming controllers, AR/VR, indoor navigation

    Package Offering

    • LGA
    • QFN/DFN
    • Custom Packages

    Key Technologies

    • Laser grooving/Low k Wafer
    • Backgrind to 100um (300mm)
    • Weltable flank step cut or side wall Etch options
    • Laminate, MIS, lead Frame (LF)
    • Transfer & Compression Molding
    • Integrated EMI Shielding in package
    • Wire AU (0.5mil-2.0mil) capability