• Connect with Carsem

SOIC

    Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. It is one of the most commonly used surface mount packages today.

    Applications

    Used for packaging wide range of devices e.g. ASIC, Power, MEMS, hall sensor, digital isolators, switching etc. in commercial, industrial & automotive segments

    Note:
    SOICN/W Lead pitching 1.27mm
    QSOP Lead pitching 0.65mm

    Package Portfolio

    Pin SOICN QSOP SOICW
    8
    14
    16
    20
    24
    28

    Features

    • Standard JEDEC package outlines
    • Moisture Sensitivity Level 1 & Grade 0 bill of material available
    • One stop assembly & test (turnkey) facilities
    • Wire interconnect in both gold & copper wires
    • Leadframe roughening for reliability enhancement
    • Exposed pad option for thermal enhancement
    • AOI & enhanced traceability for automotive products
    • Pb-free and RoHS compliant

    Multi Chip Package

    soic-mcp-1

    Increased functionality with same foot print

    • Multi chip up to 6 dies (2D)
    • Stack die (2.5D)
    • Die to die wire bond

    FCOL Capability

    soic-fcol-2

    Maximized die to package ratio

    • Flip Chip process
    • Screen printing
    • DAF laminated

    Customized Package

    High volume manufacturing for both automotive & commercial markets. Please find below availability for Small Outline Package variations; some of these packages are also available in below configurations:

    • Flip Chip (solder bump & copper pillar)
    • Stack die
    • Chip on Lead ( COL )
    • Multiple die & passive module packaging
    • Thermal enhanced package (exposed pad features)

    Customized POD for special application needs

    • Exposed pad option
    • Inverted forming
    • Zero stand off
    • Straight leads
    • Pre-mold Cavity for MEMS

    Availability

    Package Type Description Lead Count
    SOICN Small Outline Integrated Circuit (150mils) 8/14/16
    SOICW Small Outline Integrated Circuit (300mils) 16/20/24/28
    QSOP Quarter-pitch Small Outline Package 16/20/24/28
    MSOP Mini Small Outline Package 8/10
    SSOP Shrink Small Outline Package 20/24/28
    TSSOP Thin Shrink Small Outline Package 8/14/16/20/24/28/38

    Note: Specialize in Custom Package Outline to meet customer requirements for automotive application. Please contact or email to sales office by clicking below.

    Bill Of Material & Reliability Performance

    Carsem offers standard materials for low cost and high MSL performance. We support specific or non standard bill of material to meet customer requirements.

    Reliability & MSL Results

    Please contact sales office for package specific results.

    Package Outline Drawing & Datasheet

    Click lead count to view Package Outline
    SOICN (150mils) MSOP – 8 L / 10 L
    SOICW (300mils) SSOP
    QSOP (150mils) TSSOP