Carsem offers a wide variety of SOP (Small Outline Package) in the popular “gull-wing” lead format. It is one of the most commonly used surface mount packages today.
Used for packaging wide range of devices e.g. ASIC, Power, MEMS, hall sensor, digital isolators, switching etc. in commercial, industrial & automotive segments
Note:
SOICN/W Lead pitching 1.27mm
QSOP Lead pitching 0.65mm
| Pin | SOICN | QSOP | SOICW |
| 8 | ⊗ | ||
| 14 | ⊗ | ||
| 16 | ⊗ | ⊗ | ⊗ |
| 20 | ⊗ | ⊗ | |
| 24 | ⊗ | ⊗ | |
| 28 | ⊗ | ⊗ |
- Standard JEDEC package outlines
- Moisture Sensitivity Level 1 & Grade 0 bill of material available
- One stop assembly & test (turnkey) facilities
- Wire interconnect in both gold & copper wires
- Leadframe roughening for reliability enhancement
- Exposed pad option for thermal enhancement
- AOI & enhanced traceability for automotive products
- Pb-free and RoHS compliant
Increased functionality with same foot print
- Multi chip up to 6 dies (2D)
- Stack die (2.5D)
- Die to die wire bond
Maximized die to package ratio
- Flip Chip process
- Screen printing
- DAF laminated
High volume manufacturing for both automotive & commercial markets. Please find below availability for Small Outline Package variations; some of these packages are also available in below configurations:
- Flip Chip (solder bump & copper pillar)
- Stack die
- Chip on Lead ( COL )
- Multiple die & passive module packaging
- Thermal enhanced package (exposed pad features)
Customized POD for special application needs
- Exposed pad option
- Inverted forming
- Zero stand off
- Straight leads
- Pre-mold Cavity for MEMS
| Package Type | Description | Lead Count |
| SOICN | Small Outline Integrated Circuit (150mils) | 8/14/16 |
| SOICW | Small Outline Integrated Circuit (300mils) | 16/20/24/28 |
| QSOP | Quarter-pitch Small Outline Package | 16/20/24/28 |
| MSOP | Mini Small Outline Package | 8/10 |
| SSOP | Shrink Small Outline Package | 20/24/28 |
| TSSOP | Thin Shrink Small Outline Package | 8/14/16/20/24/28/38 |
Note: Specialize in Custom Package Outline to meet customer requirements for automotive application. Please contact or email to sales office by clicking below.
Carsem offers standard materials for low cost and high MSL performance. We support specific or non standard bill of material to meet customer requirements.
Please contact sales office for package specific results.