Carsem’s SiP (System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.
- High density & Routing able VS QFN
- Low cost and widely applications
- Flexible lead layout array and substrate routing
- Wide choice of paddle sizes
Applicable for a wide range of semiconductor device types in consumer market such as Switch, LNA, Filter, WLAN, Bluetooth TM, MEMS production.
3-axis acceleration sensor, measures acceleration along all 3 axis (X, Y, Z), specifically designed for low-power, and available in small and thin LGA packages.
Shielded metal CAP :
Carsem Bangkok – LGA Package
Land Grid Array (LGA) LGA is a high-performance, laminate substrate-based package that utilizes flat metal pads (lands) for external electrical connections, This surface-mount technology for high-density interconnects and superior thermal management, making it the preferred choice for high-power components.
Carsem Bangkok (CSB) provides high-performance Land Grid Array (LGA) and Gallium Nitride (GaN) packaging and capability to offers LGA and Gallium Nitride (GaN), which is advanced technology of placing single and multiple die into a single package.
- Package size : 5×5 to 8×8 mm)
- Single and multichip side by side
Solutions for NAND, Power Sensor
Computing & Data Center
- NAND Flash
Automotive Electronics
- Infotainment systems
- Power modules
Consumer Electronics
- High-power components
| Package Type | Land Count | Body Width (mm) | Body Length (mm) | Thickness (mm) |
| LGA | 8-104 | 5.0-8.0 mm | 5.0-8.0 mm | 0.8-1.04 mm |
| Substrate | BT/CCL ,2 & 4 layers |
| Die Attach | PFAS Free Conductive Epoxy Non-Conductive Epoxy DAF |
| Wire Bond | 0.8 to 1.2 mils CuPdAu /Au Wire |
| Mold Compound | Standard/Low/Super Low alpha |
| Lead Finish | Soft Au or Hard Au |
| Marking | Top – Laser |
| Packing | Tray / Tape & Reel |
| JEDEC Reference | JESD30 |
| References Specifications |
| Mil Standard 883 for Test Method and Procedures |
| J-STD-20 Moisture/Reflow Sensitivity Classification |
| JESD 22- A113 for Preconditioning for Moisture/Reflow Sensitivity Classification |