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LGA

    Carsem’s SiP (System in Package) is the advanced technology of placing multiple ICs and passive components into a single package. Our services include design, modeling as well as final test including RF testing of Bluetooth and WLAN applications.

    Features

    • High density & Routing able VS QFN
    • Low cost and widely applications
    • Flexible lead layout array and substrate routing
    • Wide choice of paddle sizes

    Applications

    Applicable for a wide range of semiconductor device types in consumer market such as Switch, LNA, Filter, WLAN, Bluetooth TM, MEMS production.

    MEMS

    3-axis acceleration sensor, measures acceleration along all 3 axis (X, Y, Z), specifically designed for low-power, and available in small and thin LGA packages.

    Micro Phone

    Shielded metal CAP :